MPC8245LZU333D Freescale Semiconductor, MPC8245LZU333D Datasheet - Page 51

• Manufacturer Part Number: MPC8245LZU333D
• Description: IC MPU 32BIT 333MHZ 352-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of MPC8245LZU333D

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 333MHz
• Voltage: 2V
• Mounting Type: Surface Mount
• Package / Case: 352-TBGA
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 333MHz
• Embedded Interface Type: I2C
• Digital Ic Case Style: TBGA
• No. Of Pins: 352
• Supply Voltage Range: 1.9V To 2.2V
• Rohs Compliant: No
• Family Name: MPC82XX
• Device Core: PowerPC
• Device Core Size: 64b
• Frequency (max): 333MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 2/2.1/3.3V
• Operating Supply Voltage (max): 2.2/3.465V
• Operating Supply Voltage (min): 1.9/3.135V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 352
• Package Type: TBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

The board designer can choose between several types of heat sinks to place on the MPC8245. Several
commercially-available heat sinks for the MPC8245 are provided by the following vendors:
Freescale Semiconductor
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC) 818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Tyco Electronics
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
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MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Figure 28. Die Junction-to-Ambient Resistance
0.5
Airflow Velocity (m/s)
1
No heat sink and high thermal board-level loading of
adjacent components
No heat sink and low thermal board-level loading of
adjacent components
Attached heat sink and high thermal board-level loading of
adjacent components
Attached heat sink and low thermal board-level loading of
adjacent components
1.5
603-224-9988
408-749-7601
800-522-6752
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2.5
System Design
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