APF30-30-10CB CTS, APF30-30-10CB Datasheet - Page 17

• Manufacturer Part Number: APF30-30-10CB
• Description: Heatsinks 30x30x10mm
• Manufacturer: CTS

Specifications of APF30-30-10CB

• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Black Anodized
• Fin Style: Horizontal
• Thermal Resistance: 3.25 C /W
• Dimensions: 30 mm L x 30 mm W x 9.5 mm H
• Designed For: BGA, PGA, PLCC, QFP
• Color: Black

ORDERING INFORMATION
Machined ZIF Enclosures are custom designed to
meet customer specifications. Please contact CTS
SPECIFICATIONS
.914mm
.036”
(Screwdriver Slot Drive)
7.938mm
.3125”
(Pin Drive)
Fig. 2
Fig. 1
Zero-Insertion Force
.125”
3.175mm
.250”
6.35mm
ROD STYLES
Unlocked,
Position
To Lock
(ZIF)
3 / 16
Visual Identification Slot
(Hexhead Drive)
CIRCUIT CARD
COLDWALL CONFIGURATION
Fig. 3
ASSEMBLY
ZIF OPERATION
Thermal Management
.150”
3.81mm
.250”
6.35mm
Mounting Surface
Circuit Board or
Cold Wall or
INSERTION
Cam Shaft
MAX. PCB
Housing
Frame
Spring
Applications Engineering Department in Burbank,
California for technical assistance.
COLDWALL
Finned areas can be
Cooling area can be
natural convection.
THERMAL IMPEDANCE:
MINIMUM PCB SPACING (inches):
MINIMUM BOARD THICKNESS:
forced air, liquid or
machined in where
Locked, Maximum
Clamping Force
Board to sink: 1.28°C-Inch/Watt
Center to center: .375” + PCB thickness
.050”
necessary.
To Unlock
Position
MIN. ZIF TO
HEAT SINK
9.398mm
.370”
6.096mm
.240”
CTS
17
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