655-53ABT5 Wakefield Thermal Solutions, 655-53ABT5 Datasheet - Page 9
![Heatsinks POWER PC 601/603 W/ADHESIVE PAD](/photos/32/60/326077/655_series_sml.jpg)
655-53ABT5
Manufacturer Part Number
655-53ABT5
Description
Heatsinks POWER PC 601/603 W/ADHESIVE PAD
Manufacturer
Wakefield Thermal Solutions
Datasheet
1.658-60ABT3.pdf
(19 pages)
Specifications of 655-53ABT5
Product
Heatsinks
Mounting Style
Adhesive
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
40.6 mm L x 40.6 mm W x 13.3 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA, PowerPC
Color
Black
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
Designed to fit a .063” thick PCB
electronic package thickness of .110”
See 609 Series for PCB hole layout for clip attachment
DIM.
“A”
619 95 AB 124 D1 S3
2.808
Thermal Interface Material Option
Blank
S5
S6
S3
S4
5
4
3
2
1
0
*Performance is for shrouded conditions. 609-100
will perform better than 609-50 in cases with bypass.
Bergquist Qpad 3
Bergquist Softface
Chomerics T710
Chomerics T443
*
609-100AB
100
None
609-50AB
AIR VELOCITY (LFM)
200
300
400
500