MC7447AHX1420LB Freescale Semiconductor, MC7447AHX1420LB Datasheet - Page 27

• Manufacturer Part Number: MC7447AHX1420LB
• Description: IC MPU RISC 1420MHZ 360-FCCBGA
• Manufacturer: Freescale Semiconductor

Specifications of MC7447AHX1420LB

• Processor Type: MPC74xx PowerPC 32-Bit
• Speed: 1.42GHz
• Voltage: 1.3V
• Mounting Type: Surface Mount
• Package / Case: 360-FCCBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

8
The following sections provide the package parameters and mechanical dimensions for the HCTE
package.
8.1
The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360-lead
high coefficient of thermal expansion ceramic ball grid array (HCTE).
Freescale Semiconductor
Package Description
Package outline
Interconnects
Pitch
Minimum module height
Maximum module height
Ball diameter
Coefficient of thermal expansion 12.3 ppm/°C
Package Parameters for the MPC7447A, 360 HCTE BGA
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
25 × 25 mm
360 (19 × 19 ball array – 1)
1.27 mm (50 mil)
2.72 mm
3.24 mm
0.89 mm (35 mil)
Package Description
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