MPC8272VRTIEA Freescale Semiconductor, MPC8272VRTIEA Datasheet - Page 55

• Manufacturer Part Number: MPC8272VRTIEA
• Description: IC MPU POWERQUICC II 516-PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8272VRTIEA

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 400MHz
• Voltage: 1.5V
• Mounting Type: Surface Mount
• Package / Case: 516-PBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -

9
Figure 13
Table 21
nomenclature of the 516 PBGA package.
Freescale Semiconductor
Package
Plated substrate via
provides package parameters.
shows the side profile of the PBGA package.
1 mm pitch
VR, ZQ
Code
In the VR package, sphere composition is lead-free (refer to
requires higher temperature reflow than what is required for other
PowerQUICC II packages. Users should consult “Freescale
PowerQUICC II™ Pb-Free Packaging Information”
(MPC8250PBFREEPKG) available at www.freescale.com.
Transfer molding compound
MPC8272 PowerQUICC II™ Family Hardware Specifications, Rev. 2
NOTE: Temperature Reflow for the VR Package
Figure 13. Side View of the PBGA Package Remove
PBGA
Type
Table 21. Package Parameters
Figure 14
27 x 27
Outline
(mm)
attach
Die
provides the mechanical dimensions and bottom surface
DIE
Interconnects
Ball bond
Wire bonds
516
Pitch
(mm)
1
Table
Nominal Unmounted
Height (mm)
2). This
Screen-printed
solder mask
Cu substrate traces
Resin glass epoxy
2.25
Package
55