MPC8247VRMIBA Freescale Semiconductor, MPC8247VRMIBA Datasheet - Page 55

• Manufacturer Part Number: MPC8247VRMIBA
• Description: IC MPU POWERQUICC II 516-PBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of MPC8247VRMIBA

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 266MHz
• Voltage: 1.5V
• Mounting Type: Surface Mount
• Package / Case: 516-PBGA
• Family Name: MPC82XX
• Device Core: PowerQUICC II
• Device Core Size: 32b
• Frequency (max): 266MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.5V
• Operating Supply Voltage (max): 1.575V
• Operating Supply Voltage (min): 1.425V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 516
• Package Type: TEPBGA
• Processor Series: MPC8xxx
• Core: 603e
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 266 MHz
• Operating Supply Voltage: 1.4 V to 1.6 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Data Ram Size: 4 KB
• I/o Voltage: 3.3 V
• Interface Type: I2C, SPI, UART
• Minimum Operating Temperature: - 40 C
• Number Of Programmable I/os: 14
• Program Memory Size: 16 KB
• Program Memory Type: EEPROM
• Core Size: 32 Bit
• Cpu Speed: 266MHz
• Digital Ic Case Style: BGA
• No. Of Pins: 516
• Supply Voltage Range: 1.425V To 1.575V
• Rohs Compliant: Yes
• For Use With: CWH-PPC-8248N-VE - KIT EVAL SYSTEM QUICCSTART 8248
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Compliant

9
Figure 13
Table 21
nomenclature of the 516 PBGA package.
Freescale Semiconductor
Package
Plated substrate via
provides package parameters.
shows the side profile of the PBGA package.
1 mm pitch
VR, ZQ
Code
In the VR package, sphere composition is lead-free (refer to
requires higher temperature reflow than what is required for other
PowerQUICC II packages. Users should consult “Freescale
PowerQUICC II™ Pb-Free Packaging Information”
(MPC8250PBFREEPKG) available at www.freescale.com.
Transfer molding compound
MPC8272 PowerQUICC II™ Family Hardware Specifications, Rev. 2
NOTE: Temperature Reflow for the VR Package
Figure 13. Side View of the PBGA Package Remove
PBGA
Type
Table 21. Package Parameters
Figure 14
27 x 27
Outline
(mm)
attach
Die
provides the mechanical dimensions and bottom surface
DIE
Interconnects
Ball bond
Wire bonds
516
Pitch
(mm)
1
Table
Nominal Unmounted
Height (mm)
2). This
Screen-printed
solder mask
Cu substrate traces
Resin glass epoxy
2.25
Package
55