MPC8247VRMIBA Freescale Semiconductor, MPC8247VRMIBA Datasheet - Page 15

• Manufacturer Part Number: MPC8247VRMIBA
• Description: IC MPU POWERQUICC II 516-PBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of MPC8247VRMIBA

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 266MHz
• Voltage: 1.5V
• Mounting Type: Surface Mount
• Package / Case: 516-PBGA
• Family Name: MPC82XX
• Device Core: PowerQUICC II
• Device Core Size: 32b
• Frequency (max): 266MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.5V
• Operating Supply Voltage (max): 1.575V
• Operating Supply Voltage (min): 1.425V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 516
• Package Type: TEPBGA
• Processor Series: MPC8xxx
• Core: 603e
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 266 MHz
• Operating Supply Voltage: 1.4 V to 1.6 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Data Ram Size: 4 KB
• I/o Voltage: 3.3 V
• Interface Type: I2C, SPI, UART
• Minimum Operating Temperature: - 40 C
• Number Of Programmable I/os: 14
• Program Memory Size: 16 KB
• Program Memory Type: EEPROM
• Core Size: 32 Bit
• Cpu Speed: 266MHz
• Digital Ic Case Style: BGA
• No. Of Pins: 516
• Supply Voltage Range: 1.425V To 1.575V
• Rohs Compliant: Yes
• For Use With: CWH-PPC-8248N-VE - KIT EVAL SYSTEM QUICCSTART 8248
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Compliant

5
Table 7
thermal management is required to ensure the junction temperature does not exceed the maximum
specified value. Also note that the I/O power should be included when determining whether to use a heat
sink. For a complete list of possible clock configurations, refer to
Modes.”
Freescale Semiconductor
JEDEC Specifications
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an
2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance
1
2
3
66.7 MHz = 0.35 W (nominal), 0.4 W (maximum)
83.3 MHz = 0.4 W (nominal), 0.5 W (maximum)
100 MHz = 0.5 W (nominal), 0.6 W (maximum)
133 MHz = 0.7 W (nominal), 0.8 W (maximum)
Test temperature = 105
P
Values do not include I/O. Add the following estimates for active I/O based on the following bus speeds:
Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp.
212–220.
Power Dissipation
INT
provides preliminary, estimated power dissipation for various configurations. Note that suitable
= I
(MHz)
66.67
Bus
100
100
133
DD
x V
DD
Table 7. Estimated Power Dissipation for Various Configurations
Watts
MPC8272 PowerQUICC II™ Family Hardware Specifications, Rev. 2
Multiplication
°
C
Factor
CPM
3
2
2
2
(MHz)
CPM
200
200
200
267
Multiplication
Factor
CPU
4
3
4
3
Section 7, “Clock Configuration
(MHz)
CPU
266
300
400
400
http://www.jedec.org
Nominal
1.1
1.3
1.5
1
Vddl 1.5 Volts
1
P
INT
(W)
Power Dissipation
Maximum
2, 3
1.2
1.3
1.5
1.8
15