XS1-L01A-TQ128-C4-THS XMOS, XS1-L01A-TQ128-C4-THS Datasheet - Page 15

IC MPU 32BIT SINGLE CORE 128TQFP

XS1-L01A-TQ128-C4-THS

Manufacturer Part Number
XS1-L01A-TQ128-C4-THS
Description
IC MPU 32BIT SINGLE CORE 128TQFP
Manufacturer
XMOS
Datasheet

Specifications of XS1-L01A-TQ128-C4-THS

Processor Type
XCore 32-Bit
Speed
400MHz
Voltage
0.95 V ~ 1.05 V
Mounting Type
Surface Mount
Package / Case
128-TQFP Exposed Pad, 128-eTQFP, 128-HTQFP, 128-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Other names
880-1023

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
XS1-L01A-TQ128-C4-THS
Manufacturer:
XMOS
Quantity:
10 000
XS1-L1 128TQFP Datasheet (2.2)
4.3 ESD Stress Voltage
4.4 Reset Timing
4.5 Power Supply
4.5.1 Power Supply Sequencing
To ensure correct device operation, the VDDIO and OTP_VDDIO supplies should be
4.5.2 Power Consumption
Notes:
Power is applied to the device through the VDDIO and VDD pins. Several pins of
each type are provided to minimize the effect of inductance within the package. All
supply pins must be connected. Each supply should be decoupled close to the chip
by several 100nF low inductance (for example, ceramic) capacitors between VDDIO
and GND, and VDD and GND.
Input voltages must not exceed specification with respect to VDDIO, VDD and GND,
even during power up and power down ramping. Permanent damage can occur if the
operation exceeds these ranges.
present before the VDD supply. Specifically, the VDDIO and OTP_VDDIO supplies
should rise to their nominal operating range with VDD held at 0V. The VDD supply
should then rise to its nominal operating range with a rise time of less than 10ms.
Core power consumption
ESD Model
HBM
MM
Parameters
Reset pulse width
Initialisation time
1. This parameter shows the time taken to start booting after RST_N has gone high.
ESD Stress Voltage
2.0 KV
200 V
MIN
5
TYP
MAX
150
UNITS
us
us
Notes
1
Notes
1
1
15/26

Related parts for XS1-L01A-TQ128-C4-THS