MPC8250AVVPIBC Freescale Semiconductor, MPC8250AVVPIBC Datasheet - Page 44

IC MPU POWERQUICC II 480-TBGA

MPC8250AVVPIBC

Manufacturer Part Number
MPC8250AVVPIBC
Description
IC MPU POWERQUICC II 480-TBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8250AVVPIBC

Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
300MHz
Voltage
2V
Mounting Type
Surface Mount
Package / Case
480-TBGA
Processor Series
MPC8xxx
Core
603e
Data Bus Width
32 bit
Maximum Clock Frequency
300 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
0 C
Family Name
MPC82XX
Device Core
PowerQUICC II
Device Core Size
32b
Frequency (max)
300MHz
Instruction Set Architecture
RISC
Operating Supply Voltage (max)
2.2V
Operating Supply Voltage (min)
1.9V
Operating Temp Range
0C to 105C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
480
Package Type
TBGA
Leaded Process Compatible
Yes
Rohs Compliant
Yes
Peak Reflow Compatible (260 C)
Yes
For Use With
CWH-PPC-8248N-VE - KIT EVAL SYSTEM QUICCSTART 8248
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8250AVVPIBC
Manufacturer:
Freescale
Quantity:
43
Part Number:
MPC8250AVVPIBC
Manufacturer:
MOTOLOLA
Quantity:
885
Part Number:
MPC8250AVVPIBC
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Pinout
Figure 16
Table 22
acronyms used in
44
BR
BG
ABB/IRQ2
TS
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
OVERBAR
MII
Plated substrate via
shows the pinout list of the PBGA package of the MPC8250.
shows the side profile of the PBGA package to indicate the direction of the top surface view.
1 mm pitch
Transfer molding compound
Table
Symbol
22.
Table 22. MPC8250 PBGA Package Pinout List
Figure 16. Side View of the PBGA Package
Pin Name
MPC8250 Hardware Specifications, Rev. 2
Table 21. Symbol Legend
Signals with overbars, such as TA, are active low.
Indicates that a signal is part of the media independent interface.
attach
Die
DIE
Ball bond
Wire bonds
Meaning
Table 21
defines conventions and
Screen-printed
solder mask
Cu substrate traces
BT resin glass epoxy
Freescale Semiconductor
Ball
C16
D2
C1
D1
D5
E8
C4
B4
A4
D7
D8
C6
B5
B6
C7
C8
A6
D9

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