STA2062A STMicroelectronics, STA2062A Datasheet
STA2062A
Specifications of STA2062A
Related parts for STA2062A
STA2062A Summary of contents
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... Package: – LFBGA16x16x1.4 mm (19x19 balls) – 0.8 mm ball pitch, (0.4 mm ball) – Full array ■ Ambient temperature range: -40 / +85 °C Table 1. Device summary Order code Package STA2062A LFBGA361 Rev 1 STA2062A Data Brief : 1.2 V ±10 1.8 V ±10%, IO Packing Tray 1/5 www.st.com 5 ...
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... Description 1 Description The STA2062A is an highly integrated SoC application processor combining host capability with embedded GPS. STA2062A targets vehicles and personal mobile navigation (PND), telematics, advance audio and connectivity systems. Figure 1: Block diagram ARM926 microcontroller and its peripherals are interfaced. Block diagram Figure 1 ...
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... STA2062A 2 Package information In order to meet environmental requirements, ST offers this device in ECOPACK This package has a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...
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... Revision history 3 Revision history Table 2. Document revision history Date 16-Apr-2008 4/5 Revision 1 Initial release. STA2062A Changes ...
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... STA2062A Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...