XC4036XL-1BG352C Xilinx Inc, XC4036XL-1BG352C Datasheet - Page 68

• Manufacturer Part Number: XC4036XL-1BG352C
• Description: IC FPGA C-TEMP 3.3V 1SPD 352MBGA
• Manufacturer: Xilinx Inc
• Series: XC4000E/Xr

Specifications of XC4036XL-1BG352C

• Number Of Logic Elements/cells: 3078
• Number Of Labs/clbs: 1296
• Total Ram Bits: 41472
• Number Of I /o: 288
• Number Of Gates: 36000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 352-LBGA, Metal
• Case: BGA
• Dc: 01+
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

XC4000E and XC4000X Series Field Programmable Gate Arrays
XC4000 Series Electrical Characteristics and Device-Specific Pinout Table
For the latest Electrical Characteristics and package/pinout information for each XC4000 Family, see the Xilinx web site at
http://www.xilinx.com/xlnx/xweb/xil_publications_index.jsp
Ordering Information
Revision Control
6-72
3/30/98 (1.5) Updated XC4000XL timing and added XC4002XL
1/29/99 (1.5) Updated pin diagrams
5/14/99 (1.6) Replaced Electrical Specification and pinout pages for E, EX, and XL families with separate updates and
Version
Example:
added URL link for electrical specifications/pinouts for Web users
Speed Grade
Device Type
-6
-5
-4
-3
-2
-1
Product Obsolete or Under Obsolescence
PC = Plastic Lead Chip Carrier
PQ = Plastic Quad Flat Pack
VQ = Very Thin Quad Flat Pack
TQ = Thin Quad Flat Pack
XC4013E-3HQ240C
Package Type
BG = Ball Grid Array
PG = Ceramic Pin Grid Array
HQ = High Heat Dissipation Quad Flat Pack
MQ = Metal Quad Flat Pack
CB = Top Brazed Ceramic Quad Flat Pack
Description
Number of Pins
Temperature Range
C = Commercial (T
I = Industrial (T
M = Military (T
C
= -55 to+125 C)
J
= -40 to +100 C)
May 14, 1999 (Version 1.6)
J
= 0 to +85 C)
X9020
R