XC3S1400AN-4FGG676I Xilinx Inc, XC3S1400AN-4FGG676I Datasheet - Page 107
![IC FPGA SPARTAN-AN 1400K 676FBGA](/photos/6/73/67300/b-676_sml.jpg)
XC3S1400AN-4FGG676I
Manufacturer Part Number
XC3S1400AN-4FGG676I
Description
IC FPGA SPARTAN-AN 1400K 676FBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3ANr
Datasheets
1.XC3S50A-4VQG100C.pdf
(7 pages)
2.XC3S50AN-4TQG144C.pdf
(2 pages)
3.XC3S50AN-4TQG144C.pdf
(123 pages)
Specifications of XC3S1400AN-4FGG676I
Total Ram Bits
589824
Number Of Logic Elements/cells
25344
Number Of Labs/clbs
2816
Number Of I /o
502
Number Of Gates
1400000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
676-BBGA
No. Of Logic Blocks
2816
No. Of Gates
1400000
No. Of Macrocells
25344
Family Type
Spartan-3AN
No. Of Speed Grades
4
No. Of I/o's
502
Clock
RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC3S1400AN-4FGG676I
Manufacturer:
PANASONIC
Quantity:
10 000
Company:
Part Number:
XC3S1400AN-4FGG676I
Manufacturer:
Xilinx Inc
Quantity:
10 000
Company:
Part Number:
XC3S1400AN-4FGG676I/XC3S1400AN-5FGG676C
Manufacturer:
XILINX
0
User I/Os by Bank
Table 79
The AWAKE pin is counted as a dual-purpose I/O.
Table 79: User I/Os Per Bank for the XC3S700AN in the FGG484 Package
Table 80: User I/Os Per Bank for the XC3S1400AN in the FGG484 Package
Footprint Migration Differences
Table 81
FPGAs that can affect migration between devices available in the FGG484 package. All other pins unconditionally migrate
between the Spartan-3AN devices available in the FGG484 package.
Spartan-3AN FPGAs are pin compatible with the same density Spartan-3A FPGAs in the FG(G)484 package, although the
Spartan-3A FPGAs require an external configuration source.
In
right. Migration in the other direction is possible depending on how the pin is configured for the device on the right.
Table 81: FGG484 XC3S700AN to XC3S1400AN Footprint Migration/Differences
DS557 (v4.1) April 1, 2011
Product Specification
Top
Right
Bottom
Left
Top
Right
Bottom
Left
Table
FGG484 Ball
Package
Package
Edge
Edge
Total
Total
U16
U7
T8
81, the arrow () indicates that this pin can unconditionally migrate from the device on the left to the device on the
and
summarizes the three footprint and functionality differences between the XC3S700AN and the XC3S1400AN
Table 80
I/O Bank
I/O Bank
0
1
2
3
0
1
2
3
indicate how the user-I/O pins are distributed between the four I/O banks on the FGG484 package.
Number of Differences:
Bank
2
2
2
Maximum I/Os
Maximum I/Os
N.C.
N.C.
N.C.
372
375
92
94
92
94
92
94
95
94
XC3S700AN
195
195
I/O
I/O
58
33
43
61
58
33
43
61
www.xilinx.com
INPUT
INPUT
17
15
11
17
60
17
15
13
17
62
All Possible I/O Pins by Type
All Possible I/O Pins by Type
Spartan-3AN FPGA Family: Pinout Descriptions
Migration
3
DUAL
DUAL
30
21
52
30
21
52
1
0
1
0
INPUT/VREF
INPUT
INPUT
VREF
VREF
33
10
34
XC3S1400AN
8
8
9
8
8
8
8
CLK
CLK
32
32
8
8
8
8
8
8
8
8
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