EP1SGX10DF672I6 Altera, EP1SGX10DF672I6 Datasheet - Page 7

• Manufacturer Part Number: EP1SGX10DF672I6
• Description: IC STRATIX GX FPGA 10KLE 672FBGA
• Manufacturer: Altera
• Series: Stratix® GXr

Specifications of EP1SGX10DF672I6

• Number Of Logic Elements/cells: 10570
• Number Of Labs/clbs: 1057
• Total Ram Bits: 920448
• Number Of I /o: 362
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 672-FBGA
• Family Name: Stratix GX
• Number Of Logic Blocks/elements: 10570
• # I/os (max): 362
• Frequency (max): 5GHz
• Process Technology: SRAM
• Operating Supply Voltage (typ): 1.5V
• Logic Cells: 10570
• Ram Bits: 920448
• Operating Supply Voltage (min): 1.425V
• Operating Supply Voltage (max): 1.575V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 672
• Package Type: FC-FBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Number Of Gates: -
• Lead Free Status / Rohs Status: Not Compliant

Figure 1–1. Stratix GX I/O Blocks
Notes to
(1)
(2)
(3)
(4)
(5)
FPGA Functional
Description
Altera Corporation
February 2005
PLL8
PLL7
PLL1
PLL2
Figure 1–1
Banks 9 through 12 are enhanced PLL external clock output banks.
If the high-speed differential I/O pins are not used for high-speed differential signaling, they can support all of the
I/O standards except HSTL class I and II, GTL, SSTL-18 Class II, PCI, PCI-X, and AGP 1×/2×.
For guidelines for placing single-ended I/O pads next to differential I/O pads, see the Selectable I/O Standards in
Stratix & Stratix GX Devices chapter of the Stratix GX Device Handbook, Volume 2.
These I/O banks in Stratix GX devices also support the LVDS, LVPECL, and 3.3-V PCML I/O standards on
reference clocks and receiver input pins (AC coupled).
VREF1B3 VREF2B3 VREF3B3 VREF4B3 VREF5B3
VREF5B8 VREF4B8 VREF3B8 VREF2B8 VREF1B8
DQST9
DQSB9
(4)
(4)
Figure
DQST8
DQSB8
and HyperTransport I/O Block
LVDS, LVPECL, 3.3-V PCML,
and HyperTransport I/O Block
and Regular I/O Pins
LVDS, LVPECL, 3.3-V PCML,
is a top view of the Stratix GX silicon die.
1–1:
and Regular I/O Pins
DQST7
DQSB7
Bank 8
Bank 3
I/O Banks 1 and 2 Support All
Single-Ended I/O Standards Except
Differential HSTL Output Clocks,
Differential SSTL-2 Output Clocks,
HSTL Class II, GTL, SSTL-18 Class II,
PCI, PCI-X, and AGP 1 × /2 ×
DQSB6
DQST6
(3)
Stratix GX devices contain a two-dimensional row- and column-based
architecture to implement custom logic. A series of column and row
interconnects of varying length and speed provide signal interconnects
between logic array blocks (LABs), memory block structures, and DSP
blocks.
(3)
DQSB5
DQST5
Note (1)
I/O Banks 3, 4, 9 & 10 Support
All Single-Ended I/O Standards
I/O Banks 7, 8, 11 & 12 Support
All Single-Ended I/O Standards
11
9
PLL5
PLL6
10
12
PLL11
PLL12
VREF1B4 VREF2B4 VREF3B4 VREF4B4 VREF5B4
VREF5B7 VREF4B7 VREF3B7 VREF2B7 VREF1B7
DQST4
DQSB4
Introduction to the Stratix GX Device Data Sheet
(2)
1.5-V PCML
(2)
DQST3
DQSB3
(5)
Stratix GX Device Handbook, Volume 1
DQSB2
DQST2
Bank 7
Bank 4
DQST1
DQSB1
DQST0
DQSB0
I/O Bank 13
I/O Bank 14
I/O Bank 17
I/O Bank 16
I/O Bank 15
1–5
(5)
(5)
(5)
(5)
(5)