EP2SGX60EF1152C3N Altera, EP2SGX60EF1152C3N Datasheet - Page 138
EP2SGX60EF1152C3N
Manufacturer Part Number
EP2SGX60EF1152C3N
Description
IC STRATIX II GX 60K 1152-FBGA
Manufacturer
Altera
Series
Stratix® II GXr
Datasheet
1.EP2SGX30DF780C5.pdf
(316 pages)
Specifications of EP2SGX60EF1152C3N
Number Of Logic Elements/cells
60440
Number Of Labs/clbs
3022
Total Ram Bits
2544192
Number Of I /o
534
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
1152-FBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Other names
544-2181
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EP2SGX60EF1152C3N
Manufacturer:
ATMEL
Quantity:
1 420
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I/O Structure
2–130
Stratix II GX Device Handbook, Volume 1
Series termination without
calibration
Table 2–34. On-Chip Termination Support by I/O Banks (Part 1 of 2)
On-Chip Termination Support
On-Chip Termination
Stratix II GX devices provide differential (for the LVDS technology I/O
standard) and series on-chip termination to reduce reflections and
maintain signal integrity. On-chip termination simplifies board design by
minimizing the number of external termination resistors required.
Termination can be placed inside the package, eliminating small stubs
that can still lead to reflections.
Stratix II GX devices provide four types of termination:
■
■
■
■
Table 2–34
bank.
3.3-V LVTTL
3.3-V LVCMOS
2.5-V LVTTL
2.5-V LVCMOS
1.8-V LVTTL
1.8-V LVCMOS
1.5-V LVTTL
1.5-V LVCMOS
SSTL-2 class I and II
SSTL-18 class I
SSTL-18 class II
1.8-V HSTL class I
1.8-V HSTL class II
1.5-V HSTL class I
1.2-V HSTL
Differential termination (R
Series termination (R
Series termination (R
Parallel termination (R
I/O Standard Support
shows the Stratix II GX on-chip termination support per I/O
S
S
) without calibration
) with calibration
T
) with calibration
Top and Bottom Banks
D
)
(3, 4, 7, 8)
v
v
v
v
v
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v
v
v
v
v
v
v
v
v
Altera Corporation
Left Bank (1, 2)
October 2007
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