ADSP-21061LAS-176 Analog Devices Inc, ADSP-21061LAS-176 Datasheet - Page 47

• Manufacturer Part Number: ADSP-21061LAS-176
• Description: IC DSP CONTROLLER 32BIT 240MQFP
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Floating Pointr

Specifications of ADSP-21061LAS-176

• Rohs Status: RoHS non-compliant
• Interface: Synchronous Serial Port (SSP)
• Clock Rate: 44MHz
• Non-volatile Memory: External
• On-chip Ram: 128kB
• Voltage - I/o: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 240-MQFP, 240-PQFP
• Device Core Size: 32b
• Architecture: Super Harvard
• Format: Floating Point
• Clock Freq (max): 44MHz
• Mips: 44
• Device Input Clock Speed: 44MHz
• Ram Size: 128KB
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 3.15V
• Operating Supply Voltage (max): 3.45V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 240
• Package Type: MQFP
• Lead Free Status / Rohs Status: Not Compliant

ENVIRONMENTAL CONDITIONS
Thermal Characteristics
The ADSP-21061 is available in 240-lead thermally enhanced
MQFP package. The top surface of the thermally enhanced
MQFP contains a metal slug from which most of the die heat is
dissipated. The slug is flush with the top surface of the package.
Note that the metal slug is internally connected to GND
through the device substrate.
The ADSP-21061L is available in 240-lead MQFP and 225-ball
plastic BGA packages.
All packages are specified for a case temperature (T
ensure that the T
flow source may be used. A heat sink should be attached with a
thermal adhesive.
T
T
PD =Power dissipation in W (this value depends upon the spe-
cific application; a method for calculating PD is shown under
Power Dissipation).
θ
Table 29. ADSP-21061 (5 V Thermally Enhanced ED/MQFP
Package)
Table 30. ADSP-21061L (3.3 V MQFP Package)
Table 31. ADSP-21061L (3.3 V PBGA Package)
Parameter
θ
Parameter
θ
Parameter
θ
CA
CASE
CASE
CA
CA
CA
=Value from tables below.
= T
= Case temperature (measured on top surface of package)
AMB
+ ( PD
Condition (Linear Ft./Min.)
Airflow = 0
Airflow = 100
Airflow = 200
Airflow = 400
Airflow = 600
Condition (Linear Ft./Min.)
Airflow = 0
Airflow = 100
Airflow = 200
Airflow = 400
Airflow = 600
Condition (Linear Ft./Min.)
Airflow = 0
Airflow = 200
Airflow = 400
CASE
θ
is not exceeded, a heatsink and/or an air-
CA)
Typical
10
9
8
7
6
Typical
19.6
17.6
15.6
13.9
12.2
Typical
19.0
13.6
11.2
CASE
Rev. C | Page 47 of 56 | July 2007
). To
Unit
°C/W
Unit
°C/W
Unit
°C/W
ADSP-21061/ADSP-21061L