EPM570F100C4N Altera, EPM570F100C4N Datasheet - Page 9

• Manufacturer Part Number: EPM570F100C4N
• Description: IC MAX II CPLD 570 LE 100-FBGA
• Manufacturer: Altera
• Series: MAX® IIr

Specifications of EPM570F100C4N

• Programmable Type: In System Programmable
• Delay Time Tpd(1) Max: 5.4ns
• Voltage Supply - Internal: 2.5V, 3.3V
• Number Of Logic Elements/blocks: 570
• Number Of Macrocells: 440
• Number Of I /o: 76
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 100-FBGA
• Voltage: 2.5V, 3.3V
• Memory Type: FLASH
• Number Of Logic Elements/cells: 570
• Family Name: MAX II
• # Macrocells: 440
• Frequency (max): 2.3148GHz
• Propagation Delay Time: 7ns
• Number Of Logic Blocks/elements: 57
• # I/os (max): 76
• Operating Supply Voltage (typ): 2.5/3.3V
• In System Programmable: Yes
• Operating Supply Voltage (min): 2.375V
• Operating Supply Voltage (max): 3.6V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: FBGA
• No. Of I/o's: 76
• Propagation Delay: 7ns
• Global Clock Setup Time: 1.5ns
• Frequency: 247.5MHz
• Supply Voltage Range: 2.375V To 2.625V, 3V To 3.6V
• Operating Temperature Range: 0°C To +85°C
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 544-1716

Introduction
Functional Description
© October 2008 Altera Corporation
MII51002-2.2
This chapter describes the architecture of the MAX II device and contains the
following sections:
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MAX
implement custom logic. Row and column interconnects provide signal interconnects
between the logic array blocks (LABs).
The logic array consists of LABs, with 10 logic elements (LEs) in each LAB. An LE is a
small unit of logic providing efficient implementation of user logic functions. LABs
are grouped into rows and columns across the device. The MultiTrack interconnect
provides fast granular timing delays between LABs. The fast routing between LEs
provides minimum timing delay for added levels of logic versus globally routed
interconnect structures.
The MAX II device I/O pins are fed by I/O elements (IOE) located at the ends of LAB
rows and columns around the periphery of the device. Each IOE contains a
bidirectional I/O buffer with several advanced features. I/O pins support Schmitt
trigger inputs and various single-ended standards, such as 66-MHz, 32-bit PCI, and
LVTTL.
MAX II devices provide a global clock network. The global clock network consists of
four global clock lines that drive throughout the entire device, providing clocks for all
resources within the device. The global clock lines can also be used for control signals
such as clear, preset, or output enable.
“Functional Description” on page 2–1
“Logic Array Blocks” on page 2–4
“Logic Elements” on page 2–6
“MultiTrack Interconnect” on page 2–12
“Global Signals” on page 2–16
“User Flash Memory Block” on page 2–18
“MultiVolt Core” on page 2–22
“I/O Structure” on page 2–23
®
II devices contain a two-dimensional row- and column-based architecture to
2. MAX II Architecture
MAX II Device Handbook