EPM2210GF256C5N Altera, EPM2210GF256C5N Datasheet - Page 36

• Manufacturer Part Number: EPM2210GF256C5N
• Description: IC MAX II CPLD 2210 LE 256-FBGA
• Manufacturer: Altera
• Series: MAX® IIr

Specifications of EPM2210GF256C5N

• Programmable Type: In System Programmable
• Delay Time Tpd(1) Max: 7.0ns
• Voltage Supply - Internal: 1.71 V ~ 1.89 V
• Number Of Logic Elements/blocks: 2210
• Number Of Macrocells: 1700
• Number Of I /o: 204
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 256-FBGA
• Voltage: 1.8V
• Memory Type: FLASH
• Number Of Logic Elements/cells: 2210
• Cpld Type: FLASH
• No. Of Macrocells: 1700
• No. Of I/o's: 204
• Propagation Delay: 11.2ns
• Global Clock Setup Time: 1.9ns
• Frequency: 201.1MHz
• Rohs Compliant: Yes
• Family Name: MAX II
• # Macrocells: 1700
• Frequency (max): 1.8797GHz
• Propagation Delay Time: 11.2ns
• Number Of Logic Blocks/elements: 221
• # I/os (max): 204
• Operating Supply Voltage (typ): 1.8V
• In System Programmable: Yes
• Operating Supply Voltage (min): 1.71V
• Operating Supply Voltage (max): 1.89V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 256
• Package Type: FBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 544-1391; EPM2210GF256C5N

2–28
Figure 2–23. MAX II I/O Banks for EPM1270 and EPM2210
Notes to
(1)
(2)
MAX II Device Handbook
Figure 2–23
Figure 2–23
Figure
2–23:
is a top view of the silicon die.
is a graphical representation only. Refer to the pin list and the Quartus II software for exact pin locations.
I/O Bank 1
Each I/O bank has dedicated V
in that bank. A single device can support 1.5-V, 1.8-V, 2.5-V, and 3.3-V interfaces; each
individual bank can support a different standard. Each I/O bank can support
multiple standards with the same V
V
the input and output buffers in MAX II devices.
The JTAG pins for MAX II devices are dedicated pins that cannot be used as regular
I/O pins. The pins TMS, TDI, TDO, and TCK support all the I/O standards shown in
Table 2–4 on page 2–27
devices and their I/O standard support is controlled by the V
PCI Compliance
The MAX II EPM1270 and EPM2210 devices are compliant with PCI applications as
well as all 3.3-V electrical specifications in the PCI Local Bus Specification Revision 2.2.
These devices are also large enough to support PCI intellectual property (IP) cores.
Table 2–5
specifications.
CCIO
is 3.3 V, Bank 3 can support LVTTL, LVCMOS, and 3.3-V PCI. V
shows the MAX II device speed grades that meet the PCI timing
All I/O Banks Support
■
■
■
■
except for PCI. These pins reside in Bank 1 for all MAX II
3.3-V LVTTL/LVCMOS
2.5-V LVTTL/LVCMOS
1.8-V LVTTL/LVCMOS
1.5-V LVCMOS
I/O Bank 2
I/O Bank 4
CCIO
(Note
pins that determine the voltage standard support
CCIO
1),
for input and output pins. For example, when
(2)
© October 2008 Altera Corporation
I/O Bank 3
CCIO
Also Supports
the 3.3-V PCI
I/O Standard
Chapter 2: MAX II Architecture
setting for Bank 1.
CCIO
powers both
I/O Structure