EPM1270F256C4 Altera, EPM1270F256C4 Datasheet - Page 38
![IC MAX II CPLD 1270 LE 256-FBGA](/photos/6/70/67063/544-256-fbga_sml.jpg)
EPM1270F256C4
Manufacturer Part Number
EPM1270F256C4
Description
IC MAX II CPLD 1270 LE 256-FBGA
Manufacturer
Altera
Series
MAX® IIr
Specifications of EPM1270F256C4
Programmable Type
In System Programmable
Delay Time Tpd(1) Max
6.2ns
Voltage Supply - Internal
2.5V, 3.3V
Number Of Logic Elements/blocks
1270
Number Of Macrocells
980
Number Of I /o
212
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
256-FBGA
Voltage
2.5V, 3.3V
Memory Type
FLASH
Number Of Logic Elements/cells
1270
For Use With
544-2380 - KIT DEV MAXII W/EPM 1270N
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Other names
544-1140
EPM1270F256C4ES
EPM1270F256C4ES
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2–30
Slew-Rate Control
Open-Drain Output
Programmable Ground Pins
MAX II Device Handbook
Table 2–6. Programmable Drive Strength
The output buffer for each MAX II device I/O pin has a programmable output slew-
rate control that can be configured for low noise or high-speed performance. A faster
slew rate provides high-speed transitions for high-performance systems. However,
these fast transitions may introduce noise transients into the system. A slow slew rate
reduces system noise, but adds a nominal output delay to rising and falling edges.
The lower the voltage standard (for example, 1.8-V LVTTL) the larger the output
delay when slow slew is enabled. Each I/O pin has an individual slew-rate control,
allowing the designer to specify the slew rate on a pin-by-pin basis. The slew-rate
control affects both the rising and falling edges.
MAX II devices provide an optional open-drain (equivalent to open-collector) output
for each I/O pin. This open-drain output enables the device to provide system-level
control signals (for example, interrupt and write enable signals) that can be asserted
by any of several devices. This output can also provide an additional wired-OR plane.
Each unused I/O pin on MAX II devices can be used as an additional ground pin.
This programmable ground feature does not require the use of the associated LEs in
the device. In the Quartus II software, unused pins can be set as programmable GND
on a global default basis or they can be individually assigned. Unused pins also have
the option of being set as tri-stated input pins.
3.3-V LVTTL
3.3-V LVCMOS
2.5-V LVTTL/LVCMOS
1.8-V LVTTL/LVCMOS
1.5-V LVCMOS
Note to
(1) The I
is specified by the I/O standard. The I
maximum, where the V
condition is V
I/O Standard
Table
OH
current strength numbers shown are for a condition of a V
2–6:
OUT
= 1.7 V and the I
OL
maximum is specified by the I/O standard. For 2.5-V LVTTL/LVCMOS, the I
OL
condition is V
OL
current strength numbers shown are for a condition of a V
(Note 1)
IOH/IOL Current Strength Setting (mA)
OUT
= 0.7 V.
OUT
16
14
= V
8
8
4
7
6
3
4
2
OH
minimum, where the V
© October 2008 Altera Corporation
Chapter 2: MAX II Architecture
OH
minimum
OUT
OH
I/O Structure
= V
OL