EPM1270F256C4 Altera, EPM1270F256C4 Datasheet - Page 12

• Manufacturer Part Number: EPM1270F256C4
• Description: IC MAX II CPLD 1270 LE 256-FBGA
• Manufacturer: Altera
• Series: MAX® IIr

Specifications of EPM1270F256C4

• Programmable Type: In System Programmable
• Delay Time Tpd(1) Max: 6.2ns
• Voltage Supply - Internal: 2.5V, 3.3V
• Number Of Logic Elements/blocks: 1270
• Number Of Macrocells: 980
• Number Of I /o: 212
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 256-FBGA
• Voltage: 2.5V, 3.3V
• Memory Type: FLASH
• Number Of Logic Elements/cells: 1270
• For Use With: 544-2380 - KIT DEV MAXII W/EPM 1270N
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Other names: 544-1140; EPM1270F256C4ES

2–4
Logic Array Blocks
Figure 2–3. MAX II LAB Structure
Note to
(1) Only from LABs adjacent to IOEs.
LAB Interconnects
MAX II Device Handbook
Fast I/O connection
to IOE (1)
DirectLink
interconnect from
adjacent LAB
or IOE
DirectLink
interconnect to
adjacent LAB
or IOE
Figure
2–3:
Each LAB consists of 10 LEs, LE carry chains, LAB control signals, a local interconnect,
a look-up table (LUT) chain, and register chain connection lines. There are 26 possible
unique inputs into an LAB, with an additional 10 local feedback input lines fed by LE
outputs in the same LAB. The local interconnect transfers signals between LEs in the
same LAB. LUT chain connections transfer the output of one LE’s LUT to the adjacent
LE for fast sequential LUT connections within the same LAB. Register chain
connections transfer the output of one LE’s register to the adjacent LE’s register
within an LAB. The Quartus
adjacent LABs, allowing the use of local, LUT chain, and register chain connections
for performance and area efficiency.
The LAB local interconnect can drive LEs within the same LAB. The LAB local
interconnect is driven by column and row interconnects and LE outputs within the
same LAB. Neighboring LABs, from the left and right, can also drive an LAB’s local
interconnect through the DirectLink connection. The DirectLink connection feature
minimizes the use of row and column interconnects, providing higher performance
and flexibility. Each LE can drive 30 other LEs through fast local and DirectLink
interconnects.
Logic Element
Figure 2–4
LE0
LE1
LE2
LE3
LE4
LE5
LE6
LE7
LE8
LE9
LAB
shows the DirectLink connection.
®
II software places associated logic within an LAB or
Figure 2–3
Local Interconnect
Row Interconnect
shows the MAX II LAB.
© October 2008 Altera Corporation
Chapter 2: MAX II Architecture
Column Interconnect
Fast I/O connection
to IOE (1)
DirectLink
interconnect from
adjacent LAB
or IOE
DirectLink
interconnect to
adjacent LAB
or IOE
Logic Array Blocks