TDA8777HL/14/C1,11 NXP Semiconductors, TDA8777HL/14/C1,11 Datasheet - Page 18

IC TRIPLE VIDEO DAC 10BIT 48LQFP

TDA8777HL/14/C1,11

Manufacturer Part Number
TDA8777HL/14/C1,11
Description
IC TRIPLE VIDEO DAC 10BIT 48LQFP
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TDA8777HL/14/C1,11

Number Of Bits
10
Data Interface
Parallel
Number Of Converters
3
Voltage Supply Source
Single Supply
Power Dissipation (max)
297mW
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
48-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Settling Time
-
Other names
935275422118
TDA8777HL/14/C1-T
TDA8777HL/14/C1-T

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TDA8777HL/14/C1,11
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Philips Semiconductors
18. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
9
10
11
12
13
14
14.1
14.2
14.3
14.4
14.5
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Thermal characteristics. . . . . . . . . . . . . . . . . . . 7
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Application information. . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Contact information. . . . . . . . . . . . . . . . . . . . . 17
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Voltage reference . . . . . . . . . . . . . . . . . . . . . . . 5
Blanking and sync pulse insertion . . . . . . . . . . 6
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 13
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 14
Package related soldering information . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Triple 10-bit video DAC, up to 330 MHz sample frequency
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© Koninklijke Philips Electronics N.V. 2006.
For more information, please visit: http://www.semiconductors.philips.com.
For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com.
Document identifier: TDA8777_4
TDA8777
Date of release: 11 April 2006
All rights reserved.

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