AD9775BSV Analog Devices Inc, AD9775BSV Datasheet - Page 9
AD9775BSV
Manufacturer Part Number
AD9775BSV
Description
IC DAC 14BIT DUAL 160MSPS 80TQFP
Manufacturer
Analog Devices Inc
Series
TxDAC+®r
Datasheet
1.AD9775BSVZRL.pdf
(56 pages)
Specifications of AD9775BSV
Rohs Status
RoHS non-compliant
Settling Time
11ns
Number Of Bits
14
Data Interface
Parallel
Number Of Converters
2
Voltage Supply Source
Analog and Digital
Power Dissipation (max)
410mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
For Use With
AD9775-EBZ - BOARD EVALUATION FOR AD9775
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ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter
AVDD, DVDD, CLKVDD
AVDD, DVDD, CLKVDD
AGND, DGND, CLKGND
REFIO, FSADJ1/FSADJ2
I
P1B13 to P1B0, P2B13 to P2B0, RESET
DATACLK, PLL_LOCK
CLK+, CLK–
LPF
SPI_CSB, SPI_CLK, SPI_SDIO, SPI_SDO
Junction Temperature
Storage Temperature
Lead Temperature (10 sec)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
OUTA
, I
OUTB
With Respect To
AGND, DGND, CLKGND
AVDD, DVDD, CLKVDD
AGND, DGND, CLKGND
AGND
AGND
DGND
DGND
CLKGND
CLKGND
DGND
Rev. E | Page 9 of 56
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 8. Thermal Resistance
Package Type
80-Lead Thin Quad Flat Package
(TQFP_EP), Exposed Pad
JA
is specified for the worst-case conditions, that is, a device
Rating
−0.3 V to +4.0 V
−4.0 V to +4.0 V
−0.3 V to +0.3 V
−0.3 V to AVDD + 0.3 V
−1.0 V to AVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to CLKVDD + 0.3 V
−0.3 V to CLKVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
125°C
−65°C to +150°C
300°C
θ
23.5
JA
Unit
°C/W
AD9775