M25P32-VMF6P Micron Technology Inc, M25P32-VMF6P Datasheet - Page 33

• Manufacturer Part Number: M25P32-VMF6P
• Manufacturer: Micron Technology Inc

Specifications of M25P32-VMF6P

• Cell Type: NOR
• Density: 32Mb
• Access Time (max): 8ns
• Interface Type: Serial (SPI)
• Boot Type: Not Required
• Address Bus: 1b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: SOIC W
• Program/erase Volt (typ): 8.5 to 9.5V
• Sync/async: Synchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8b
• Number Of Words: 4M
• Supply Current: 8mA
• Mounting: Surface Mount
• Pin Count: 16
• Lead Free Status / Rohs Status: Compliant

6.11
Deep Power-down (DP)
Executing the Deep Power-down (DP) instruction is the only way to put the device in the
lowest consumption mode (the Deep Power-down mode). It can also be used as a software
protection mechanism, while the device is not in active use, as in this mode, the device
ignores all Write, Program and Erase instructions.
Driving Chip Select (S) High deselects the device, and puts the device in the Standby Power
mode (if there is no internal cycle currently in progress). But this mode is not the Deep
Power-down mode. The Deep Power-down mode can only be entered by executing the
Deep Power-down (DP) instruction, subsequently reducing the standby current (from I
I
To take the device out of Deep Power-down mode, the Release from Deep Power-down and
Read Electronic Signature (RES) instruction must be issued. No other instruction must be
issued while the device is in Deep Power-down mode.
The Release from Deep Power-down and Read Electronic Signature (RES) instruction also
allows the Electronic Signature of the device to be output on Serial Data Output (Q).
The Deep Power-down mode automatically stops at Power-down, and the device always
Powers-up in the Standby Power mode.
The Deep Power-down (DP) instruction is entered by driving Chip Select (S) Low, followed
by the instruction code on Serial Data Input (D). Chip Select (S) must be driven Low for the
entire duration of the sequence.
The instruction sequence is shown in
Chip Select (S) must be driven High after the eighth bit of the instruction code has been
latched in, otherwise the Deep Power-down (DP) instruction is not executed. As soon as
Chip Select (S) is driven High, it requires a delay of t
to I
Any Deep Power-down (DP) instruction, while an Erase, Program or Write cycle is in
progress, is rejected without having any effects on the cycle that is in progress.
Figure 18. Deep Power-down (DP) instruction sequence
CC2
S
C
D
CC2
, as specified in
and the Deep Power-down mode is entered.
0
Table
1
2
Instruction
14).
3
4
5
6
Figure
7
18.
DP
Stand-by Mode
before the supply current is reduced
t
DP
Deep Power-down Mode
AI03753D
CC1
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