M25P32-VMF6P Micron Technology Inc, M25P32-VMF6P Datasheet - Page 14

• Manufacturer Part Number: M25P32-VMF6P
• Manufacturer: Micron Technology Inc

Specifications of M25P32-VMF6P

• Cell Type: NOR
• Density: 32Mb
• Access Time (max): 8ns
• Interface Type: Serial (SPI)
• Boot Type: Not Required
• Address Bus: 1b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: SOIC W
• Program/erase Volt (typ): 8.5 to 9.5V
• Sync/async: Synchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8b
• Number Of Words: 4M
• Supply Current: 8mA
• Mounting: Surface Mount
• Pin Count: 16
• Lead Free Status / Rohs Status: Compliant

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Active Power, Standby Power and Deep Power-down modes
When Chip Select (S) is Low, the device is selected, and in the Active Power mode.
When Chip Select (S) is High, the device is deselected, but could remain in the Active
Power mode until all internal cycles have completed (Program, Erase, Write Status
Register). The device then goes in to the Standby Power mode. The device consumption
drops to I
The Deep Power-down mode is entered when the specific instruction (the Deep Power-
down (DP) instruction) is executed. The device consumption drops further to I
device remains in this mode until another specific instruction (the Release from Deep
Power-down and Read Electronic Signature (RES) instruction) is executed.
While in the Deep Power-down mode, the device ignores all Write, Program and Erase
instructions (see
mechanism, when the device is not in active use, to protect the device from inadvertent
Write, Program or Erase instructions.
Status Register
The Status Register contains a number of status and control bits that can be read or set (as
appropriate) by specific instructions. See
detailed description of the Status Register bits.
CC1
.
Deep Power-down
(DP)) This can be used as an extra software protection
Section 6.4: Read Status Register (RDSR)
CC2
. The
for a