TJA1021T/10.118 NXP Semiconductors, TJA1021T/10.118 Datasheet
TJA1021T/10.118
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TJA1021T/10.118 Summary of contents
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TJA1021 LIN 2.1/SAE J2602 transceiver Rev. 05 — 22 October 2009 1. General description The TJA1021 is the interface between the Local Interconnect Network (LIN) master/slave protocol controller and the physical bus in a LIN primarily intended for ...
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... NXP Semiconductors I Bus terminal and battery pin protected against transients in the automotive environment (ISO 7637) I Bus terminal short-circuit proof to battery and ground I Thermally protected 3. Quick reference data Table 1. Quick reference data +150 C; R BAT vj currents flow into the IC; typical values are given at V ...
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... NXP Semiconductors 5. Block diagram 7 V BAT 3 WAKE_N 2 SLP_N 4 TXD 1 RXD Fig 1. Block diagram TJA1021_5 Product data sheet WAKE-UP TIMER CONTROL SLEEP/ TEMPERATURE NORMAL PROTECTION TIMER TXD TIME-OUT TIMER TJA1021 BUS TIMER RXD/ INT Rev. 05 — 22 October 2009 TJA1021 LIN 2.1/SAE J2602 transceiver ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 2. 6.2 Pin description Table 3. Symbol RXD SLP_N WAKE_N TXD GND LIN V BAT INH 7. Functional description The TJA1021 is the interface between the LIN master/slave protocol controller and the physical bus in a Local Interconnect Network (LIN). The TJA1021 is LIN 2.1/SAE J2602 compliant and provides optimum ElectroMagnetic Compatibility (EMC) performance due to wave shaping of the LIN output ...
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... NXP Semiconductors switching on V Fig 3. Table 4. Operating modes Mode SLP_N TXD (output) Sleep mode 0 weak pull-down [1] Standby 0 weak pull-down if mode remote wake-up; strong pull-down if local wake-up Normal mode 1 HIGH: recessive state LOW: dominant state Power-on mode 0 weak pull-down [1] Standby mode is entered automatically upon any local or remote wake-up event during Sleep mode. Pin INH and the 30 k termination resistor at pin LIN are switched on ...
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... NXP Semiconductors [5] Power-on mode is entered after switching on V 7.2 Sleep mode This mode is the most power-saving mode of the TJA1021. Despite its extreme low current consumption, the TJA1021 can still be woken up remotely via pin LIN, or woken up locally via pin WAKE_N, or activated directly via pin SLP_N. Filters at the inputs of the receiver (LIN), of pin WAKE_N and of pin SLP_N prevent unwanted wake-up events due to automotive transients or EMI ...
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... NXP Semiconductors integrated filter to suppress bus line noise. The transmit data stream of the protocol controller at the TXD input is converted by the transmitter into a bus signal with optimized slew rate and wave shaping to minimize EME. The LIN bus output pin is pulled HIGH via an internal slave termination resistor ...
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... NXP Semiconductors has been added, a HIGH level indicates a remote wake-up request (weak pull-down at pin TXD) and a LOW level indicates a local wake-up request (strong pull-down at pin TXD; much stronger than the external pull-up resistor). The wake-up request flag (signalled on pin RXD) as well as the wake-up source flag (signalled on pin TXD) are reset immediately after the microcontroller sets pin SLP_N HIGH ...
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... NXP Semiconductors Fig 4. TJA1021_5 Product data sheet LIN recessive V 0.4V t LIN BAT dom(LIN) LIN dominant sleep mode Remote wake-up behavior Rev. 05 — 22 October 2009 TJA1021 LIN 2.1/SAE J2602 transceiver V BAT 0.6V BAT ground standby mode 001aae071 © NXP B.V. 2009. All rights reserved. ...
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... NXP Semiconductors 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to pin GND; unless otherwise specified. Positive currents flow into the IC. Symbol Parameter V supply voltage on pin V BAT V voltage on pin TXD TXD ...
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... NXP Semiconductors 10. Static characteristics Table 7. Static characteristics +150 C; R BAT vj currents flow into the IC; typical values are given at V Symbol Parameter Supply I supply current on pin BAT V BAT Power-on reset V LOW-level power-on th(POR)L reset threshold voltage V HIGH-level power-on th(POR)H reset threshold voltage ...
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... NXP Semiconductors Table 7. Static characteristics +150 C; R BAT vj currents flow into the IC; typical values are given at V Symbol Parameter Pin SLP_N V HIGH-level input IH voltage V LOW-level input voltage IL V hysteresis voltage hys R pull-down resistance on PD(SLP_N) pin SLP_N I LOW-level input current V IL ...
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... NXP Semiconductors Table 7. Static characteristics +150 C; R BAT vj currents flow into the IC; typical values are given at V Symbol Parameter V receiver dominant th(dom)RX threshold voltage V receiver recessive th(rec)RX threshold voltage V center receiver th(RX)cntr threshold voltage V receiver hysteresis th(hys)RX threshold voltage R slave resistance ...
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... NXP Semiconductors Table 8. Dynamic characteristics +150 C; R BAT vj currents flow into the IC; typical values are given at V Symbol Parameter 3 duty cycle 3 4 duty cycle 4 Timing characteristics t fall time f t rise time r t difference between rise (r-f) and fall time t transmitter propagation ...
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... NXP Semiconductors t bus rec max ------------------------------- - [ bit [6] Load condition pin RXD and R RXD [7] For V > the LIN transmitter might be suppressed. If TXD is HIGH then the LIN transmitter output is recessive. BAT t bit V TXD V BAT LIN BUS signal V RXD receiving node 1 t p(rx1)f V RXD receiving node 2 Fig 5 ...
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... NXP Semiconductors 12. Application information V DD RX0 MICRO- TX0 CONTROLLER Px.x GND (1) Master nF; slave 220 pF. Fig 6. Typical application of the TJA1021 13. Test information Fig 7. Immunity against automotive transients (malfunction and damage) in accordance with LIN EMC Test Specification / Version 1.0; August 1, 2004. The waveforms of the applied transients are according to ISO7637-2: Draft 2002-12, test pulses 1, 2a, 3a and 3b ...
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... NXP Semiconductors 14. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 0. terminal 1 index area terminal 1 index area Dimensions (1) Unit max 1.00 0.05 0.35 mm nom 0.85 0.03 0.30 0.2 min 0.80 0.00 0.25 Note 1. Plastic or metal protrusions of 0.075 maximum per side are not included. ...
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... NXP Semiconductors 15. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 16. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “ ...
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... NXP Semiconductors • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 16.4 Reflow soldering Key characteristics in reflow soldering are: • ...
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... NXP Semiconductors Fig 10. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . TJA1021_5 Product data sheet maximum peak temperature = MSL limit, damage level temperature minimum peak temperature ...
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... NXP Semiconductors 17. Revision history Table 11. Revision history Document ID Release date TJA1021_5 20091022 • Modifications: HVSON package added TJA1021_4 20090119 TJA1021_3 20071008 TJA1021_2 20070903 TJA1021_1 20061016 TJA1021_5 Product data sheet Data sheet status Change notice Product data sheet - Product data sheet ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 19. Contact information For more information, please visit: For sales office addresses, please send an email to: TJA1021_5 Product data sheet http://www.nxp.com salesaddresses@nxp.com Rev. 05 — 22 October 2009 TJA1021 LIN 2.1/SAE J2602 transceiver © NXP B.V. 2009. All rights reserved ...
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... NXP Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 Low power management . . . . . . . . . . . . . . . . . 1 2.3 Protection mechanisms . . . . . . . . . . . . . . . . . . 1 3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 4 7.1 Operating modes . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 Sleep mode ...