PMBFJ174 NXP Semiconductors, PMBFJ174 Datasheet
PMBFJ174
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PMBFJ174 Summary of contents
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... DATA SHEET PMBFJ174 to 177 P-channel silicon field-effect transistors Product specification DISCRETE SEMICONDUCTORS April 1995 ...
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... April 1995 3 handbook, halfpage 1 2 Top view Fig.1 Simplified outline and symbol, SOT23. V max max. GSO I max max. tot PMBFJ174 20 I DSS 135 Product specification PMBFJ174 to 177 MAM386 300 mW 175 176 177 300 125 250 ...
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... Drain current Gate-source breakdown voltage = 1 Gate-source cut-off voltage I = nA Drain-source ON-resistance Note 1. Mounted on a ceramic substrate 0,7 mm. April 1995 PMBFJ174 to 177 V max max. GSO V max. GDO I max max. tot T stg T max j-a PMBFJ174 I ...
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... Turn-off time Test conditions: −V DD handbook, halfpage 50 Ω D.U.T 50 Ω Fig.2 Switching times test circuit April 1995 off off out MBK292 4 PMBFJ174 to 177 typ. 8 typ. 30 typ. 4 PMBFJ174 175 176 typ typ typ typ typ typ 560 1200 2000 GSoff INPUT 10% ...
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... OUTLINE VERSION IEC SOT23 April 1995 scale 3.0 1.4 2.5 1.9 0.95 2.8 1.2 2.1 REFERENCES JEDEC JEITA TO-236AB 5 Product specification PMBFJ174 to 177 detail 0.45 0.55 0.2 0.1 0.15 0.45 EUROPEAN PROJECTION SOT23 ISSUE DATE 04-11-04 06-03-16 ...
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... Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. 6 Product specification PMBFJ174 to 177 DEFINITION ...
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... April 1995 PMBFJ174 to 177 Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data ...
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... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...