MT47H256M4HQ-3 IT:E TR Micron Technology Inc, MT47H256M4HQ-3 IT:E TR Datasheet - Page 21

• Manufacturer Part Number: MT47H256M4HQ-3 IT:E TR
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H256M4HQ-3 IT:E TR

• Organization: 256Mx4
• Density: 1Gb
• Address Bus: 17b
• Access Time (max): 450ps
• Maximum Clock Rate: 667MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 120mA
• Pin Count: 60
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Compliant

Figure 9: 60-Ball FBGA Package (8mm x 11.5mm) – x4, x8
PDF: 09005aef821ae8bf
Rev. O 9/08 EN
Dimensions
apply to solder
balls post reflow.
60X Ø0.45
8
Seating
0.12 A
plane
0.8 TYP
0.8 TYP
Note:
A
9
8
1. All dimensions are in millimeters.
7
8 ±0.15
6.4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
Exposed
gold-plated pad
1.0mm (MAX) X
0.7mm (NOM)
nonconductive floating pad
0.8 ±0.1
Ball A1 ID
21
11.5 ±0.15
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.20 MAX
1Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID location
Packaging