BUK209-50Y NXP Semiconductors, BUK209-50Y Datasheet - Page 7

BUK209-50Y

Manufacturer Part Number
BUK209-50Y
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BUK209-50Y

Switch Type
High Side
Power Switch Family
BUK209
Power Switch On Resistance
60mOhm
Output Current
6A
Number Of Outputs
Single
Mounting
Through Hole
Supply Current
4mA
Package Type
TO-220
Operating Temperature (max)
150C
Pin Count
5 +Tab
Power Dissipation
56W
Lead Free Status / Rohs Status
Compliant
Philips Semiconductors
MECHANICAL DATA
1 Refer to mounting instructions for TO220 envelopes. Epoxy meets UL94 VO at 1/8". Net mass: 2 g
September 2002
TOPFET high side switch
Plastic single-ended package; heatsink mounted; 1 mounting hole;
5-lead TO-220 lead form option
DIMENSIONS (mm are the original dimensions)
Notes
1. Terminal dimensions are uncontrolled in this zone.
2. Positional accuracy of the terminals is controlled in this zone.
UNIT
mm
SOT263B-01
VERSION
OUTLINE
Fig.4. SOT263B package
4.5
4.1
A
1.39
1.27
A 1
0.85
0.70
b
0.7
0.4
c
D
L
IEC
15.8
15.2
D
D 1
6.4
5.9
D 1
e
m
1
10.3
9.7
E
5-lead (option)
TO-220
JEDEC
1
∅ p
1.7
p 1
E
e
leadform 263B-01, pin 3 connected to mounting base.
b
REFERENCES
9.8
9.7
L
5
0
5.9
5.3
L 1
L 4
q
w
5.2
5.0
L 3
L 2
M
scale
EIAJ
7
5
L 3
2.4
1.6
(1)
L 4
max.
0.5
10 mm
(2)
mounting
base
0.8
0.6
m
L 2
∅ p
3.8
3.6
Q
R
Q 1
4.3
4.1
p 1
A
A 1
Q 2
R
3.0
2.7
q
PROJECTION
EUROPEAN
2.0
Q
c
Q 1
4.5
L 1
Q 2
8.2
ISSUE DATE
0.5
R
01-01-11
SOT263B-01
Product specification
0.4
BUK209-50Y
w
Rev 2.000

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