MT9LSDT1672G-13EB1 Micron Technology Inc, MT9LSDT1672G-13EB1 Datasheet - Page 12

no-image

MT9LSDT1672G-13EB1

Manufacturer Part Number
MT9LSDT1672G-13EB1
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT9LSDT1672G-13EB1

Main Category
DRAM Module
Sub-category
SDRAM
Module Type
168RDIMM
Device Core Size
72b
Organization
16Mx72
Total Density
128MByte
Chip Density
128Mb
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3.3V
Operating Current
1.485A
Number Of Elements
9
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Operating Temp Range
0C to 55C
Operating Temperature Classification
Commercial
Pin Count
168
Mounting
Socket
Lead Free Status / Rohs Status
Compliant
Serial Presence-Detect
Table 13:
Table 14:
Serial Presence-Detect Data
PDF: 09005aef80a2e32f/Source: 09005aef80a2e30d
SD9C16_32x72.fm - Rev. D 1/08 EN
Parameter/Condition
Parameter/Condition
Supply voltage
Input high voltage: Logic 1; All inputs
Input low voltage: Logic 0; All inputs
Output low voltage: I
Input leakage current: V
Output leakage current: V
Standby current
Power supply current, read: SCL clock frequency = 100 kHz
Power supply current, write: SCL clock frequency = 100 kHz
SCL LOW to SDA data-out valid
Time the bus must be free before a new transition can start
Data-out hold time
Clock/data fall time
Clock/data rise time
Data-in hold time
Start condition hold time
Clock HIGH period
Noise suppression time constant at SCL, SDA inputs
Clock LOW period
SCL clock frequency
Data-in setup time
Start condition setup time
Stop condition setup time
WRITE cycle time
Serial Presence-Detect EEPROM DC Operating Conditions
Serial Presence-Detect EEPROM AC Operating Conditions
Notes:
OUT
IN
= 3mA
OUT
= GND to V
1. To avoid spurious start and stop conditions, a minimum delay is placed between SCL = 1 and
2. This parameter is sampled.
3. For a restart condition or following a WRITE cycle.
4. The SPD EEPROM WRITE cycle time (
For the latest serial presence-detect data, refer to Micron’s SPD page:
www.micron.com/SPD.
= GND to V
the falling or rising edge of SDA.
sequence to the end of the EEPROM internal ERASE/PROGRAM cycle. During the WRITE
cycle, the EEPROM bus interface circuit is disabled, SDA remains HIGH due to pull-up resis-
tance, and the EEPROM does not respond to its slave address.
DD
DD
128MB, 256MB (x72, ECC, SR): 168-Pin SDRAM RDIMM
12
t
Symbol
Symbol
t
t
t
t
HD:DAT
V
HD:STA
SU:DAT
SU:STA
SU:STO
t
t
t
t
t
HIGH
DDSPD
LOW
f
WRC
I
t
t
I
WRC) is the time from a valid stop condition of a write
V
BUF
V
I
CC
SCL
V
I
AA
DH
CC
I
t
t
LO
SB
t
OL
LI
R
IH
F
I
IL
Micron Technology, Inc., reserves the right to change products or specifications without notice.
W
R
V
DDSPD
Min
200
100
0.2
1.3
0.6
0.6
1.3
0.6
0.6
0
Min
–0.6
0.10
0.05
1.7
1.6
0.4
2.0
× 0.7
Serial Presence-Detect
Max
300
300
400
0.9
50
10
©2003 Micron Technology, Inc. All rights reserved
V
V
DDSPD
DDSPD
Max
3.6
0.4
3.0
3.0
4.0
1.0
3.0
Units
+ 0.5
× 0.3
kHz
ms
µs
µs
ns
ns
ns
µs
µs
ns
ns
µs
µs
µs
µs
Units
Notes
mA
mA
µA
µA
µA
V
V
V
V
1
2
2
3
4

Related parts for MT9LSDT1672G-13EB1