MT9LSDT1672G-13EB1 Micron Technology Inc, MT9LSDT1672G-13EB1 Datasheet - Page 10

• Manufacturer Part Number: MT9LSDT1672G-13EB1
• Manufacturer: Micron Technology Inc

Specifications of MT9LSDT1672G-13EB1

• Main Category: DRAM Module
• Sub-category: SDRAM
• Module Type: 168RDIMM
• Device Core Size: 72b
• Organization: 16Mx72
• Total Density: 128MByte
• Chip Density: 128Mb
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 3.3V
• Operating Current: 1.485A
• Number Of Elements: 9
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Operating Temp Range: 0C to 55C
• Operating Temperature Classification: Commercial
• Pin Count: 168
• Mounting: Socket
• Lead Free Status / Rohs Status: Compliant

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Table 9:
Table 10:
PDF: 09005aef80a2e32f/Source: 09005aef80a2e30d
SD9C16_32x72.fm - Rev. D 1/08 EN
Parameter/Condition
Parameter/Condition
Operating current: Active mode; BL = 2; Read or write;
Standby current: Power-down mode; All device banks idle; CKE = LOW
Standby current: Active mode; CKE = HIGH; CS# = HIGH; All device banks
active after
Operating current: Burst mode; Page burst; Read or write; All device banks
active
Auto refresh current: CS# = HIGH; CKE = HIGH
Self refresh current: CKE ≤ 0.2V
Operating current: Active mode; BL = 2; Read or write;
Standby current: Power-down mode; All device banks idle; CKE = LOW
Standby current: Active mode; CKE = HIGH; CS# = HIGH; All device banks active
after
Operating current: Burst mode; Page burst; Read or write; All device banks
active
Auto refresh current: CS# = HIGH; CKE = HIGH
Self refresh current: CKE ≤ 0.2V
DD
Specifications
t
RCD has been met; No accesses in progress
t
RCD has been met; No accesses in progress
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Values are shown for the MT48LC16M8A2 SDRAM components only and are computed from values specified
in the 128Mb (16 Meg x 8) component data sheet
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Values are shown for the MT48LC32M8A2 SDRAM components only and are computed from values specified
in the 256Mb (32 Meg x 8) component data sheet
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Specifications and Conditions – 128MB
Specifications and Conditions – 256MB
128MB, 256MB (x72, ECC, SR): 168-Pin SDRAM RDIMM
t
t
RC =
RC =
t
t
RFC =
RFC = 7.8125µs
10
t
t
RFC =
RFC = 15.625µs
t
t
RC (MIN)
RC (MIN)
t
RFC (MIN)
t
RFC (MIN)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Symbol
Symbol
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I
I
I
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I
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DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
1
2
3
4
5
6
7
1
2
3
4
5
6
7
Electrical Specifications
1,440
1,485
2,970
1,215
1,215
2,560
-13E
-13E
450
360
©2003 Micron Technology, Inc. All rights reserved
18
27
18
18
32
23
1,350
1,350
2,790
1,125
1,215
2,430
-133
-133
450
360
18
27
18
18
32
23
Units
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA