SP000245649 Infineon Technologies, SP000245649 Datasheet - Page 4

• Manufacturer Part Number: SP000245649
• Manufacturer: Infineon Technologies

Specifications of SP000245649

• Lead Free Status / Rohs Status: Not Compliant

Development Tool
―
1
Table 1:
For more ordering information please contact your local Infineon sales office.
Figure 1: Pad Configuration Die
Table 2
Symbol
L
L
1)
Short Product Information
Type
SRF 55V02P HC C
SRF 55V02P HC NB
A
B
Available as a Module Flip Chip Contactless (MFCC1), Module Contactless Card (MCC) for embedding in plastic
cards, as NiAu-bump version (NB) or as a die on sawn / unsawn wafer for customer packaging
my-d
®
Ordering and Packaging information
Evaluation Kit including my-d
Ordering Information
Pin Definitions and Functions
Function
Antenna connection
Antenna connection
Package
Wafer
Sawn wafer
L
A
1)
SRF 55V02P HC
®
m y-d
Manager Software
®
256 bytes
vicinity
4 / 8
User
Memory
64 bytes
Admin.
L
B
Pages
my-d
32
SRF 55V02P HC
®
Ordering Code
SP000245648
SP000245649
vicinity plain
2007-07-02