TDA8920TH NXP Semiconductors, TDA8920TH Datasheet - Page 2

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TDA8920TH

Manufacturer Part Number
TDA8920TH
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TDA8920TH

Operational Class
Class-D
Output Power (typ)
140x1@8Ohm/80x2@4OhmW
Audio Amplifier Function
Speaker
Total Harmonic Distortion
0.02@8Ohm@1W%
Single Supply Voltage (typ)
Not RequiredV
Dual Supply Voltage (typ)
±25V
Power Supply Requirement
Dual
Rail/rail I/o Type
No
Single Supply Voltage (min)
Not RequiredV
Single Supply Voltage (max)
Not RequiredV
Dual Supply Voltage (min)
±12.5V
Dual Supply Voltage (max)
±30V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
24
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TDA8920TH/N1
Manufacturer:
NXP
Quantity:
5
Part Number:
TDA8920TH/N1
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Philips Semiconductors
CONTENTS
1
2
3
4
5
6
7
8
8.1
8.2
8.3
8.3.1
8.3.2
8.3.3
8.3.4
8.4
9
10
11
12
13
14
2002 Sep 25
2
80 W class-D power amplifier
FEATURES
APPLICATIONS
GENERAL DESCRIPTION
ORDERING INFORMATION
QUICK REFERENCE DATA
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
General
Pulse width modulation frequency
Protections
Over-temperature
Short-circuit across the loudspeaker terminals
and to supply lines
Start-up safety test
Supply voltage alarm
Differential audio inputs
LIMITING VALUES
THERMAL CHARACTERISTICS
QUALITY SPECIFICATION
STATIC CHARACTERISTICS
SWITCHING CHARACTERISTICS
DYNAMIC AC CHARACTERISTICS (STEREO
AND DUAL SE APPLICATION)
2
15
16
16.1
16.2
16.3
16.4
16.5
16.6
16.7
16.8
16.9
16.10
16.11
16.12
17
18
18.1
18.2
18.3
18.4
18.5
19
20
21
DYNAMIC AC CHARACTERISTICS (MONO
BTL APPLICATION)
APPLICATION INFORMATION
BTL application
MODE pin
Output power estimation
External clock
Heatsink requirements
Output current limiting
Pumping effects
Reference design
PCB information for HSOP24 encapsulation
Classification
Reference design: bill of materials
Curves measured in the reference design
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
Product specification
TDA8920

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