BAP64-04 NXP Semiconductors, BAP64-04 Datasheet - Page 2

Two planar PIN diodes in series configuration in a SOT23 small plastic SMD package

BAP64-04

Manufacturer Part Number
BAP64-04
Description
Two planar PIN diodes in series configuration in a SOT23 small plastic SMD package
Manufacturer
NXP Semiconductors
Type
Attenuator/Switchr
Datasheet

Specifications of BAP64-04

Configuration
Dual Series
Forward Current
100mA
Forward Voltage
1.1V
Power Dissipation
250mW
Operating Temperature Classification
Military
Reverse Voltage
175V
Package Type
SOT-23
Mounting
Surface Mount
Maximum Series Resistance @ Minimum If
40@0.5mAOhm
Maximum Series Resistance @ Maximum If
1.35@100mAOhm
Typical Carrier Life Time
1.55us
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
3
Applications Frequency Range
SHF
Lead Free Status / Rohs Status
Compliant

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Manufacturer
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Price
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NXP Semiconductors
FEATURES
 High voltage, current controlled
 RF resistor for RF attenuators and switches
 Low diode capacitance
 Low diode forward resistance
 Low series inductance
 For applications up to 3 GHz.
APPLICATIONS
 RF attenuators and switches.
DESCRIPTION
Two planar PIN diodes in series configuration in a SOT23
small plastic SMD package.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
1999 Sep 21
Per diode
V
I
P
T
T
SYMBOL
F
stg
j
R
tot
Silicon PIN diode
continuous reverse voltage
continuous forward current
total power dissipation
storage temperature
junction temperature
PARAMETER
T
s
= 90 C
2
PINNING
handbook, halfpage
CONDITIONS
Marking code: 4Kp.
Fig.1 Simplified outline (SOT23) and symbol.
2
PIN
1
2
3
3
1
65
65
anode
cathode
common connection
MIN.
Product specification
2
DESCRIPTION
175
100
250
+150
+150
BAP64-04
MAX.
3
V
mA
mW
C
C
MAM232
UNIT
1

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