BAP64-03 NXP Semiconductors, BAP64-03 Datasheet
BAP64-03
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BAP64-03 Summary of contents
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... DATA SHEET BAP64-03 Silicon PIN diode Product specification Supersedes data of 1999 Aug 27 DISCRETE SEMICONDUCTORS 2004 Feb 11 ...
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... DESCRIPTION plastic surface mounted package; 2 leads CONDITIONS = 90 Product specification PIN DESCRIPTION 1 cathode 2 anode 1 2 Fig.1 Simplified outline (SOD323) and symbol. MIN. 65 65 BAP64-03 sym006 VERSION SOD323 MAX. UNIT 175 V 100 mA 500 mW C +150 C +150 ...
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... MHz; note mA 100 MHz; note 100 mA 100 MHz; note 1 F when switched from 100 ; measured mA PARAMETER 3 Product specification BAP64-03 TYP. MAX. UNIT 0.95 1.1 V A 10 A 1 0.48 pF 0.35 pF 0.23 0.35 pF ...
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... S 21 (dB) −10 −20 −30 0.5 1 1.5 2 Diode zero biased and inserted in series with a 50 stripline circuit C. T amb 2 Fig.5 Isolation ( the diode as a function of 21 frequency; typical values. Product specification BAP64-03 MCD774 (V) MCD776 2 (GHz) ...
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... Note 1. The marking bar indicates the cathode OUTLINE VERSION IEC SOD323 2004 Feb scale 1.8 1.35 2.7 0.45 0.25 0.2 1.6 1.15 2.3 0.15 0.15 REFERENCES JEDEC JEITA SC-76 5 Product specification BAP64- detail EUROPEAN ISSUE DATE PROJECTION SOD323 Q c 03-12-17 06-03-16 ...
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... Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. 6 Product specification BAP64-03 DEFINITION ...
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... NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 7 Product specification BAP64-03 ...
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... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...