DAC8413FP Analog Devices Inc, DAC8413FP Datasheet - Page 7

• Manufacturer Part Number: DAC8413FP
• Description: IC DAC 12BIT QUAD V-OUT 28-DIP
• Manufacturer: Analog Devices Inc

Specifications of DAC8413FP

• Rohs Status: RoHS non-compliant
• Settling Time: 6µs
• Number Of Bits: 12
• Data Interface: Parallel
• Number Of Converters: 4
• Voltage Supply Source: Single Supply
• Power Dissipation (max): 330mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 28-DIP (0.600", 15.24mm)

ABSOLUTE MAXIMUM RATINGS
T
Table 3.
Parameter
V
V
V
V
V
V
Current into Any V
Digital Input Voltage to DGND
Digital Output Voltage to DGND
Operating Temperature Range
Junction Temperature
Storage Temperature Range
Power Dissipation Package
Lead Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
SS
SS
LOGIC
SS
REFH
REFH
A
EP, FP, FPC
AT, BT, BTC
Soldering
= +25°C, unless otherwise noted.
to V
to V
to V
to V
to V
to DGND
DD
LOGIC
REFL
DD
REFL
SS
pin
Rating
−0.3 V, +33.0 V
−0.3 V, +33.0 V
−0.3 V, +7.0 V
−0.3 V, +V
+2.0 V, +33.0 V
+2.0 V, V
±15 mA
−0.3 V, V
−0.3 V, +7.0 V
−40°C to +85°C
−55°C to +125°C
150°C
−65°C to +150°C
1000 mW
JEDEC Industry Standard
J-STD-020
SS
LOGIC
SS
− V
− 2.0 V
+ 0.3 V
DD
Rev. F | Page 7 of 20
THERMAL RESISTANCE
θ
device in socket.
Table 4. Thermal Resistance
Package Type
28-Lead Plastic DIP (PDIP)
28-Terminal Ceramic Leadless Chip Carrier (LLC)
28-Lead Plastic Leaded Chip Carrier (PLLC)
28-Lead Ceramic Dual In-Line Package (CERDIP)
ESD CAUTION
JA
is specified for the worst-case mounting conditions, that is, a
DAC8412/DAC8413
θ
48
70
63
51
JA
θ
22
28
25
9
JC
Unit
°C/W
°C/W
°C/W
°C/W