MT48V16M32L2B5-8 IT Micron Technology Inc, MT48V16M32L2B5-8 IT Datasheet

MT48V16M32L2B5-8 IT

Manufacturer Part Number
MT48V16M32L2B5-8 IT
Description
Manufacturer
Micron Technology Inc
Type
Mobile SDRAMr
Datasheet

Specifications of MT48V16M32L2B5-8 IT

Organization
16Mx32
Density
512Mb
Address Bus
15b
Access Time (max)
8.5/7.5ns
Maximum Clock Rate
125MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
165mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Compliant
Mobile SDRAM
MT48LC16M32L2 – 4 Meg x 32 x 4 Banks
MT48V16M32L2 – 4 Meg x 32 x 4 Banks
MT48H16M32L2 – 4 Meg x 32 x 4 Banks
Features
• Low voltage power supply
• Partial array self refresh power-saving mode
• Temperature compensated self refresh (TCSR)
• Deep power-down mode
• Programmable output drive strength
• Fully synchronous; all signals registered on positive
• Internal pipelined operation; column address can
• Internal banks for hiding row access/precharge
• Programmable burst lengths: 1, 2, 4, 8, or full page
• Auto precharge, includes concurrent auto
• Self refresh mode; standard and low power
• 64ms, 8,192-cycle refresh
• LVTTL-compatible inputs and outputs
• Operating temperature range
• Industrial (-40°C to +85°C)
• Supports CAS latency of 1, 2, 3
PDF: 09005aef817f1b8c/Source: 09005aef818112f1
512Mb Mobile SDRAM_TwinDie_x32.fm - Rev. C 6/05 EN
Options
• V
• Configuration
• Package/ballout
• Timing (cycle time)
• Temperature
edge of system clock
be changed every clock cycle
precharge, and auto refresh modes
3.3V/3.3V
2.5V/2.5V
1.8V/1.8V
16M32 stacked die
Plastic package 90-ball FBGA
(8mm x 13mm) (standard)
Plastic package 90-ball FBGA
(8mm x 13mm) (lead-free)
8ns at CL3 (125 MHz)
10ns at CL3 (100 MHz)
Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)
DD
/V
DD
Q
Products and specifications discussed herein are subject to change by Micron without notice.
Marking
No Marking
-10
LC
B5
L2
F5
-8
IT
H
V
512Mb : x32 TwinDie Mobile SDRAM Addendum
1
Addendum Changes
The standard 256Mb SDRAM Mobile x32 data sheets
should be referenced for a complete description of
SDRAM functionality and operating modes. This
addendum data sheet will concentrate on the key dif-
ferences required to support the enhanced options of
the TwinDie configuration.
The Micron 256Mb Mobile X32 data sheet provides full
specifications and functionality unless specified
herein.
Table 1:
Table 2:
Architecture
Configuration
Refresh Count
Row Addressing
Bank Addressing
Column Addressing
Speed
Grade
-10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
-8
Key Timing Parameters
Configuration
Frequency
125 MHz
100 MHz
Clock
Access Time
©2004 Micron Technology, Inc. All rights reserved.
at CL = 3
4 Meg x 32 x 4 banks
7.5ns
7.5ns
16 Meg x 32
4 (BA0, BA1)
8K (A0–A12)
512 (A0–A8)
8K
Access Time
Features
at CL = 2
8.5ns
8.5ns

Related parts for MT48V16M32L2B5-8 IT

MT48V16M32L2B5-8 IT Summary of contents

Page 1

... Temperature Commercial (0°C to +70°C) Industrial (-40°C to +85°C) PDF: 09005aef817f1b8c/Source: 09005aef818112f1 512Mb Mobile SDRAM_TwinDie_x32.fm - Rev. C 6/05 EN Products and specifications discussed herein are subject to change by Micron without notice. 512Mb : x32 TwinDie Mobile SDRAM Addendum Addendum Changes The standard 256Mb SDRAM Mobile x32 data sheets should be referenced for a complete description of SDRAM functionality and operating modes ...

Page 2

... A0-A12 select the row). The address bits registered coincident with the READ or WRITE command are used to select the starting column location for the burst access. The SDRAM provides for programmable READ or WRITE burst lengths locations, or the full page, with a burst terminate option. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence ...

Page 3

... AUTO REFRESH command every 7.81µs will meet the refresh requirement and ensure that each row is refreshed. Alternatively, 8,192 AUTO REFRESH commands can be issued in a burst at the minimum cycle rate ( Figure 1: Functional Block Diagram PDF: 09005aef817f1b8c/Source: 09005aef818112f1 512Mb Mobile SDRAM_TwinDie_x32.fm - Rev. C 6/05 EN 512Mb : x32 TwinDie Mobile SDRAM Addendum t RC), once every 64ms. CS CLK ...

Page 4

... Ball Assignment Figure 2: 90-Ball FBGA Assignment PDF: 09005aef817f1b8c/Source: 09005aef818112f1 512Mb Mobile SDRAM_TwinDie_x32.fm - Rev. C 6/05 EN 512Mb : x32 TwinDie Mobile SDRAM Addendum DQ26 DQ24 DQ28 DQ27 DQ25 DQ29 DQ30 DQ31 DQM3 A12 J CLK CKE A9 K DQM1 DQ8 DQ10 DQ9 DQ12 DQ14 SS P DQ11 ...

Page 5

... DC Electrical Characteristics and Operating Conditions (LC version +3.3V ±0. Notes please refer to the 256Mb: x32 Mobile SDRAM data sheet for all notes. Parameter/Condition Supply Voltage Input High Voltage: Logic 1; All inputs Input Low Voltage: Logic 0; All inputs Input Leakage Current: Any input 0V ≤ V ≤ ...

Page 6

... OUT Table 6: I Specifications and Conditions (LC version +3.3V ±0.3V Notes 11, 13; please refer to the 256Mb: x32 Mobile SDRAM data sheet for all notes. Parameter/Condition Operating Current: Active Mode; Burst = 2; READ or WRITE (MIN) Standby Current: Power-Down Mode; All banks idle; CKE = LOW Standby Current: Power-Down Mode ...

Page 7

... Table 7: I Specifications and Conditions (V version +2.5 ±0.2V Notes 11, 13; please refer to the 256Mb: x32 Mobile SDRAM data sheet for all notes. Parameter/Condition Operating Current: Active Mode; Burst = 2; READ or WRITE (MIN) Standby Current: Power-Down Mode; All banks idle; CKE = LOW Standby Current: Power-Down Mode; All banks idle; ...

Page 8

... Table Self Refresh Current Options DD Note: 4; please refer to the 256Mb: x32 Mobile SDRAM data sheet for all notes. Values for I 100 percent tested. Values for 70ºC, 45ºC, and 15ºC are sampled only. Temperature Compensated Self Refresh Parameter/Condition Self Refresh Current: CKE = LOW – 4 Bank Refresh Self Refresh Current: CKE = LOW – ...

Page 9

... Table 10: Capacitance Parameter – FBGA “S2” Package Input Capacitance: CLK Input Capacitance: All other input-only balls Input/Output Capacitance: DQs PDF: 09005aef817f1b8c/Source: 09005aef818112f1 512Mb Mobile SDRAM_TwinDie_x32.fm - Rev. C 6/05 EN 512Mb : x32 TwinDie Mobile SDRAM Addendum -40 -30 -20 - Temperature (C) -40 -30 ...

Page 10

... This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range for production devices. Although considered final, these specifications are subject to change, as further product development and data characterization sometimes occur. PDF: 09005aef817f1b8c/Source: 09005aef818112f1 512Mb Mobile SDRAM_TwinDie_x32.fm - Rev. C 6/05 EN 512Mb : x32 TwinDie Mobile SDRAM Addendum 1.00 ±0.05 6.40 ...

Related keywords