SC2200UFH-266B D3 AMD (ADVANCED MICRO DEVICES), SC2200UFH-266B D3 Datasheet - Page 58
SC2200UFH-266B D3
Manufacturer Part Number
SC2200UFH-266B D3
Description
Manufacturer
AMD (ADVANCED MICRO DEVICES)
Datasheet
1.SC2200UFH-266B_D3.pdf
(429 pages)
Specifications of SC2200UFH-266B D3
Operating Temperature (min)
0C
Operating Temperature (max)
85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / Rohs Status
Not Compliant
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3.4.8
62
Signal Name
LAD3
LAD2
LAD1
LAD0
LDRQ#
LFRAME#
LPCPD#
SERIRQ
Low Pin Count (LPC) Bus Interface Signals
Ball No.
32580B
M28
K31
K28
L29
L30
L31
L28
J31
Type
I/O
I/O
O
O
I
Description
LPC Address-Data. Multiplexed command, address,
bidirectional data, and cycle status.
LPC DMA Request. Encoded DMA request for LPC
interface.
Note:
LPC Frame. A low pulse indicates the beginning of a
new LPC cycle or termination of a broken cycle.
LPC Power-Down. Signals the LPC device to prepare for
power shut-down on the LPC interface.
Serial IRQ. The interrupt requests are serialized over a
single signal, where each IRQ level is delivered during a
designated time slot.
Note:
If LDRQ# function is selected but not used, tie
LDRQ# high.
If SERIRQ function is selected but not used, tie
SERIRQ high.
AMD Geode™ SC2200 Processor Data Book
GPIO38/IRRX2
Signal Definitions
GPIO35
GPIO34
GPIO33
GPIO32
GPIO36
GPIO37
GPIO39
Mux
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