SP000011325 Infineon Technologies, SP000011325 Datasheet - Page 2

• Manufacturer Part Number: SP000011325
• Manufacturer: Infineon Technologies

Specifications of SP000011325

• Lead Free Status / Rohs Status: Not Compliant

Thermal resistance
junction - case:
junction - ambient:
SMD version, device on PCB:
Maximum Ratings at Tj = 25 °C unless otherwise specified
Parameter
Drain source voltage
Drain source voltage for short circuit protection
R
without R
Continuous input current
-0.2V
V
Operating temperature
Storage temperature
Power dissipation
T
Unclamped single pulse inductive energy
I
Electrostatic discharge voltage
according to MIL STD 883D, method 3015.7 and
EOS/ESD assn. standard S5.1 - 1993
Load dump protection V
V
t
t
DIN humidity category, DIN 40 040
IEC climatic category; DIN IEC 68-1
1
2
3
without blown air.
Semiconductor Group
D(ISO)
d
d
A sensor holding current of 500 µA has to be guaranted in the case of thermal shutdown (see also page 3)
V Loaddump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm 2 (one layer, 70 µm thick) copper area for Drain connection. PCB is vertical
IN
C
IN
CC
= 400 ms, R
= 400 ms, R
= 25 °C
=low or high; V
< -0.2V or V
= 0
= 19 A
V
CC
IN
10V
I
I
= 2
= 2
IN
A
> 10V
=13.5 V
, I
, I
D
D
LoadDump
=0,5*19A
= 19A
1)
3)
(Human Body Model)
2)
= V
A
+ V
Page 2
S
R
R
R
Symbol
V
V
I
T
T
P
E
V
V
IN
thJC
thJA
thJA
DS
DS(SC)
j
stg
tot
AS
ESD
LD
- 40 ... +150
- 55 ... +150
40/150/56
| I
no limit
Value
6000
3000
IN
110
240
0.7
15
75
45
60
50
92
E
|
2
02.12.1998
BTS 949
K/W
Unit
V
mA
°C
W
mJ
V