ISP1181BBS,557 NXP Semiconductors, ISP1181BBS,557 Datasheet - Page 64
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
ISP1181BBS,557
Manufacturer Part Number
ISP1181BBS,557
Description
Manufacturer
NXP Semiconductors
Datasheet
1.ISP1181BBS557.pdf
(73 pages)
Specifications of ISP1181BBS,557
Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Compliant
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Fig 35. HVQFN48 package outline.
ISP1181B_3
Product data sheet
HVQFN48: plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 7 x 7 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT619-2
max.
A
1
terminal 1
index area
terminal 1
index area
0.05
0.00
A 1
E h
L
12
1
0.80
0.65
A 4
13
48
IEC
- - -
0.30
0.18
b
e
0.2
c
7.15
6.85
D 1
e 1
D h
D
D
MO-220
JEDEC
1/2
6.85
6.65
D 1
e
REFERENCES
Rev. 03 — 23 January 2009
5.25
4.95
b
D h
37
7.15
6.85
24
E
JEITA
0
25
36
- - -
E 1
1/2
B
6.85
6.65
E 1
e
w
v
e
A
E
e 2
M
M
5.25
4.95
E h
C
C
scale
2.5
A
0.5
B
e
A
Full-speed USB peripheral controller
5.5
e 1
A 4
y 1 C
5 mm
A 1
5.5
e 2
PROJECTION
EUROPEAN
0.5
0.3
detail X
L
0.1
v
© ST-NXP Wireless 2009. All rights reserved.
C
X
ISP1181B
y
0.05
w
ISSUE DATE
02-05-17
02-10-22
0.05
y
SOT619-2
c
0.1
y 1
63 of 72
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