AD9742AR Analog Devices Inc, AD9742AR Datasheet - Page 6

• Manufacturer Part Number: AD9742AR
• Description: IC DAC 12BIT 210MSPS 28-SOIC
• Manufacturer: Analog Devices Inc
• Series: TxDAC®r

Specifications of AD9742AR

• Mounting Type: Surface Mount
• Rohs Status: RoHS non-compliant
• Settling Time: 11ns
• Number Of Bits: 12
• Data Interface: Parallel
• Number Of Converters: 1
• Voltage Supply Source: Analog and Digital
• Power Dissipation (max): 145mW
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Resolution (bits): 12bit
• No. Of Pins: 28
• Peak Reflow Compatible (260 C): No
• Update Rate: 210MSPS
• Supply Voltage: 3.3V
• No. Of Bits: 12 Bit
• Leaded Process Compatible: No
• For Use With: AD9742ACP-PCBZ - BOARD EVAL FOR AD9742ACP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

AD9742
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
AVDD
DVDD
CLKVDD
ACOM
ACOM
DCOM
AVDD
AVDD
DVDD
CLOCK, SLEEP
Digital Inputs, MODE
IOUTA, IOUTB
REFIO, REFLO, FS ADJ
CLK+, CLK−, MODE
Junction
Temperature
Storage
Temperature
Lead Temperature
(10 sec)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to
absolute maximum ratings for extended periods may effect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features pro-
prietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electro-
static discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or
loss of functionality.
With
Respect to
ACOM
DCOM
CLKCOM
DCOM
CLKCOM
CLKCOM
DVDD
CLKVDD
CLKVDD
DCOM
DCOM
ACOM
ACOM
CLKCOM
Min
−0.3
−0.3
−0.3
−0.3
−0.3
−0.3
−3.9
−3.9
−3.9
−0.3
−0.3
−1.0
−0.3
−0.3
−65
Max
+3.9
+3.9
+3.9
+0.3
+0.3
+0.3
+3.9
+3.9
+3.9
DVDD + 0.3
DVDD + 0.3
AVDD + 0.3
AVDD + 0.3
CLKVDD + 0.3
150
+150
300
Unit
V
V
V
V
V
V
V
V
V
V
V
V
V
V
°C
°C
°C
Rev. B | Page 6 of 32
THERMAL CHARACTERISTICS
Thermal Resistance
28-Lead 300-Mil SOIC
28-Lead TSSOP
32-Lead LFCSP
1
Thermal impedance measurements were taken on a 4-layer board in still air,
in accordance with EIA/JESD51-7.
θ
θ
θ
JA
JA
JA
= 55.9°C/W
= 67.7°C/W
= 32.5°C/W
1