AD7305BRZ Analog Devices Inc, AD7305BRZ Datasheet - Page 18

• Manufacturer Part Number: AD7305BRZ
• Description: IC DAC 8BIT QUAD 5V R-R 20-SOIC
• Manufacturer: Analog Devices Inc

Specifications of AD7305BRZ

• Data Interface: Parallel
• Settling Time: 1µs
• Number Of Bits: 8
• Number Of Converters: 4
• Voltage Supply Source: Dual ±
• Power Dissipation (max): 60mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (7.5mm Width)
• Resolution (bits): 8bit
• Sampling Rate: 1MSPS
• Input Channel Type: Parallel
• Supply Voltage Range - Analog: 2.7V To 5.5V
• Supply Current: 6mA
• Digital Ic Case Style: SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD7304/AD7305
OUTLINE DIMENSIONS
0.30 (0.0118)
0.10 (0.0039)
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
COPLANARITY
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
0.10
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Figure 39. 16-Lead Standard Small Outline Package [SOIC]
Figure 40. 20-Lead Standard Small Outline Package [SOIC]
20
1
16
1
Dimensions shown in millimeters and (inches)
Dimensions shown in millimeters and (inches)
1.27 (0.0500)
COMPLIANT TO JEDEC STANDARDS MS-013AC
(0.0500)
COMPLIANT TO JEDEC STANDARDS MS-013AA
10.50 (0.4134)
10.10 (0.3976)
1.27
BSC
BSC
0.51 (0.0201)
0.31 (0.0122)
13.00 (0.5118)
12.60 (0.4961)
0.51 (0.0201)
0.31 (0.0122)
Wide Body (R-16)
Wide Body (R-20)
9
8
2.65 (0.1043)
2.35 (0.0925)
SEATING
PLANE
11
10
7.60 (0.2992)
7.40 (0.2913)
2.65 (0.1043)
2.35 (0.0925)
SEATING
PLANE
7.60 (0.2992)
7.40 (0.2913)
10.65 (0.4193)
10.00 (0.3937)
10.65 (0.4193)
10.00 (0.3937)
0.33 (0.0130)
0.20 (0.0079)
0.33 (0.0130)
0.20 (0.0079)
8°
0°
8°
0°
0.75 (0.0295)
0.25 (0.0098)
0.75 (0.0295)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
1.27 (0.0500)
0.40 (0.0157)
× 45°
× 45°
Rev. C | Page 18 of 20
COPLANARITY
0.15
0.05
0.15
0.05
4.50
4.40
4.30
PIN 1
PIN 1
Figure 41. 16-Lead Thin Shrink Small Outline Package [TSSOP]
Figure 42. 20-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.65
0.10
16
1
20
COPLANARITY
1
BSC
0.65
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153AB
5.10
5.00
4.90
0.10
COMPLIANT TO JEDEC STANDARDS MO-153AC
6.60
6.50
6.40
Dimensions shown in millimeters
Dimensions shown in millimeters
0.30
0.19
1.20 MAX
9
8
1.20
MAX
SEATING
PLANE
BSC
6.40
11
10
SEATING
PLANE
(RU-16)
(RU-20)
0.20
0.09
4.50
4.40
4.30
0.20
0.09
6.40 BSC
8°
0°
8°
0°
0.75
0.60
0.45
0.75
0.60
0.45