UDA1334ATS/N2,118 NXP Semiconductors, UDA1334ATS/N2,118 Datasheet - Page 20

• Manufacturer Part Number: UDA1334ATS/N2,118
• Description: IC LOW POWER AUDIO DAC 16SSOP
• Manufacturer: NXP Semiconductors

Specifications of UDA1334ATS/N2,118

• Number Of Converters: 2
• Package / Case: 16-SSOP
• Number Of Bits: 24
• Data Interface: Serial
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Interface Type: Serial
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.4 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -
• Settling Time: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 935266839118; UDA1334ATSDH-T; UDA1334ATSDH-T

NXP Semiconductors
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
2001 Feb 02
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Low-cost stereo filter DAC
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(3)
, SO, SOJ
PACKAGE
20
not suitable
suitable
not recommended
not recommended
not suitable
WAVE
(2)
SOLDERING METHOD
(3)(4)
(5)
suitable
suitable
suitable
suitable
suitable
UDA1330ATS
Product specification
REFLOW
(1)