CM105X7R104K16AT AVX Corporation, CM105X7R104K16AT Datasheet - Page 16

• Manufacturer Part Number: CM105X7R104K16AT
• Description: CAPACITOR CERAMIC, 0.1UF, 16V, X7R, 0603
• Manufacturer: AVX Corporation

Specifications of CM105X7R104K16AT

• Dielectric Characteristic: X7R
• Capacitance: 0.1µF
• Capacitance Tolerance: ± 10%
• Voltage Rating: 16VDC
• Capacitor Case Style: 0603
• No. Of Pins: 2
• Capacitor Mounting: SMD
• Rohs Compliant: Yes

Soldering Method
1) Ceramic is easily damaged by rapid heating or cooling. If some heat shock is unavoidable, preheat enough to limit the temperature difference
2) The product size 1.0 0.5mm to 3.2 1.6mm can be used in reflow and wave soldering, and the product size of over 3.2 2.5mm, 0.6 0.3mm, and
3) Please see our recommended soldering conditions.
Sodering iron
1) Temperature of iron chip
2) Wattage
3) Tip shape of soldering iron
4) Soldering Time
Reflow
Wave
q Ensure that the chip capacitor is preheated adequately.
w Ensure that the temperature difference ( T) does not exceed 150 C.
e Cool naturally after soldering.
r Stop wave in more than CM32.
q Minimize soldering time.
w Ensure that allowable temperature difference does not exceed 130˚C.
(Delta T) to within 130 degree Celsius.
capacitor arrays can be used in reflow.
Circuit shortage and smoking can be created by using capacitors which are used neglecting the above caution.
Please contact us if you use lead free solder because the peak temperature of lead free is different from non-lead free.
300
250
200
150
100
50
Recommendable Temperature Profile(62Sn Solder)
300
250
200
150
100
0
50
0
60seconds
60 to 120sec.
Preheat
Preheat
350 C max
30W max
3sec. max
60seconds
3.0mm max
T
T
More than180 C,
40seconds maximum
3sec. max
230 C
260 C
Peak temperature
230 C 5 C
15seconds maximum
to
5) Cautions
Cool at normal room
temperature after
removing from
Cool at normal
room temperature
a) Pre-heating is necessary Rapid heating must be avoided.
b) Avoid direct touching to capacitors.
c) Avoid rapid cooling after soldering. Natural cooling is recommended.
furnace.
Delta T 130˚C.
Reflow
Wave
q Minimize soldering time.
w Ensure that allowable temperature difference does not exceed 130˚C.
q Ensure that the chip capacitor is preheated adequately.
w Ensure that the temperature difference ( T) does not exceed 150 C.
e Cool naturally after soldering.
Recommendable Temperature Profile(Sn-3Ag-0.5Cu)
300
250
200
150
100
300
250
200
150
100
50
0
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Multilayer Ceramic Chip Capacitors
1 to 3 C/sec.
Surface Mounting Information
Preheat
90 30sec.
Preheat
170 to 180 C
90 30sec.
T
245 to 260˚C
250 C 5 C
5 to 10sec. Max.
220 C Max.