CM105X7R104K16AT AVX Corporation, CM105X7R104K16AT Datasheet - Page 15

• Manufacturer Part Number: CM105X7R104K16AT
• Description: CAPACITOR CERAMIC, 0.1UF, 16V, X7R, 0603
• Manufacturer: AVX Corporation

Specifications of CM105X7R104K16AT

• Dielectric Characteristic: X7R
• Capacitance: 0.1µF
• Capacitance Tolerance: ± 10%
• Voltage Rating: 16VDC
• Capacitor Case Style: 0603
• No. Of Pins: 2
• Capacitor Mounting: SMD
• Rohs Compliant: Yes

Mounting Design
Recommended chip position on PCB to minimize stress from PCB warpage
Actual Mounting
Resin Mold
The chip could crack if the PCB warps during processing after the chip has been soldered.
1) If the position of the vacuum nozzle is too low, a large force may be applied to the chip capacitor during mounting, resulting in cracking.
2) During mounting, set the nozzle pressure to a static load of 100 to 300 gf.
3) To minimize the shock of the vaccum nozzle, provide a support pin on the back of the PCB to minimize PCB flexture.
4) When the positioning hook begins to wear, unstable mechanical shock may be applied to the chip capacitor, resulting in cracking.
5) To reduce the possibility of chipping and cracks, minimize vibration to chips stored in a bulk case.
6) The discharge pressure must be adjusted to the part size. Verify the pressure during setup to avoid fracturing or cracking the chips capacitors.
1) If a large amount of resin is used for molding the chip, cracks may occur due to contraction stress during curing. To avoid such cracks, use a low
2) The insulation resistance of the chip will degrade due to moisture absorption. Use a low moisture absorption resin.
3) Check carefully that the resin does not generate a decomposition gas or reaction gas during the curing process or during normal storage. Such
shrinkage resin.
gases may crack the chip capacitor or damage the device itself.
(Not recommended)
C r a c k
Multilayer Ceramic Chip Capacitors
S u p p o r t p i n
Surface Mounting Information
(Ideal)