1-1734592-4 TE Connectivity, 1-1734592-4 Datasheet - Page 2

• Manufacturer Part Number: 1-1734592-4
• Description: FFC/FPC CONNECTOR, RECEPTACLE 14POS 1ROW
• Manufacturer: TE Connectivity

Specifications of 1-1734592-4

• Gender: Receptacle
• Pitch Spacing: 0.5mm
• No. Of Contacts: 14
• No. Of Rows: 1
• Contact Plating: Gold
• Ffc/fpc Thickness: 0.3mm
• Contact Termination: Surface Mount Horizontal
• Rohs Compliant: Yes
• Termination Method To Pc Board: Surface Mount
• Pcb Mounting Orientation: Right Angle
• Pcb Mount Alignment: Without
• Pcb Mount Retention: With
• Actuator Type: Stuffer
• Shrouded: Yes
• Sealed: No
• Strain Relief: Without
• Contact Current Rating, Max (a): 0.5
• Operating Voltage Reference: AC
• Operating Voltage (vac): 250
• Shielded: No
• Tail Orientation: In-line
• Profile Height (y-axis) (mm [in]): 2.05 [0.080]
• Centerline (mm [in]): 0.50 [0.0197]
• Number Of Positions: 14
• Selectively Loaded: No
• Pcb Mount Retention Type: Solder Pads
• Length (x-axis) (mm [in]): 12.43 [0.4893]
• Width (z-axis) (mm [in]): 5.10 [0.200]
• Contact Plating, Mating Area, Material: Gold
• Contact Plating, Mating Area, Thickness (µm [?in]): 0.025 [0.984]
• Tail Plating Material: Gold
• Tail Plating, Thickness (µm [?in]): 0.025 [0.984]
• Contact Design: Single Beam
• Housing Material: Liquid Crystal Polymer (LCP)
• Contact Mating Location: Bottom
• Flex Cable Thickness (mm [in]): 0.3 [0.012]
• Housing Color: Ivory
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Circuit Identification Feature: Without
• Operating Temperature (°c [°f]): -20 – +85 [-4 – +185]
• Zif/non-zif: ZIF
• Contact Transmits (typical Application): Signal (Data)
• Pick And Place Cover: Without
• Packaging Method: Tape & Reel

Rev
1 Examination of Product
2 Contact Resistance
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9
Insulation Resistance 100M Ohm Min.(Initial)
Dielectric
Withstanding
Resistance
Durability
Vibration
Physical Shock
Contact Retention
Force
Solder ability
The product shall be designed to meet the electrical, mechanical and environmental performance
requirements specified in Figure 1. All tests shall be performed at ambient environmental conditions per
AMP Specification 109-1TEST REQUIREMENTS AND PROCEDURES SUMMARY.
3.4.
3.5.
B
Test Item
Test Item
PERFOMANCE REQUEIREMENT AND TEST DESCRIPTION
TEST REQUIREMENTS AND PROCEDURES SUMMARY
35mΩ. Max.
50M Ohm Min. ( Final)
No creeping discharge or
flashover shall occur.
Current leakage:0.5mA MAX
See Note
No electrical discontinuity
greater than 1microsecond shall
occur.
See Note.
During and after each shock,
the contacts shell be no
discontinuity
greater then 1 microsecond.
250 gf min.
Wet solder coverage:95% Min.
Meets requirements of product
drawing. No physical damage.
MECHANICAL REQUIREMENT
ELECTRICAL REQUIREMENT
Requirement
Requirement
Figure 1（cont）
Subject mated contacts assembled in
housing to 20 mV DC Max open circuit at
100mA
MIL-STD-1344A Method 3002.1
Impressed voltage 500VDC. The insulation
resistance shall be measured between 10
adjacent 10 opposing contacts per FPC
connector.
MIL-STD-202F, Method 302
250VAC for 1minute
Test between adjacent circuits of unmated
connector.
MIL-STD-202F Method 301
Operation Speed: 25.4mm/minute
Durability Cycles:15 Cycles
(1)Test duration:3 hours along
Each of 3 mutually perpendicular
Plans(9hours totally)
(2)Test board thickness:1.6±0.02mm
MIL-STD-1344A,Method 2005
(1)Number of drops:3 drops in each of 3
mutually perpendicular planes
(2)Test board thickness:1.6±0.02mm
MIL-STD-202F,Method 213.
The test shall be performed 10PCS of each
different row of contacts the crosshead
speed should be less than 20mm per
minute.
Solder Temp.:235±5℃
Duration: 5±0.5sec.
MIL-STD-202F,Method 208D.
Visual inspection.
No physical damage
Procedure
Procedure
108-57523
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