MAX5312EAE+ Maxim Integrated Products, MAX5312EAE+ Datasheet - Page 17

• Manufacturer Part Number: MAX5312EAE+
• Description: IC DAC 12BIT 5V/10V SER 16-SSOP
• Manufacturer: Maxim Integrated Products

Specifications of MAX5312EAE+

• Settling Time: 10µs
• Number Of Bits: 12
• Data Interface: Serial
• Number Of Converters: 1
• Voltage Supply Source: Dual ±
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP
• Number Of Dac Outputs: 1
• Resolution: 12 bit
• Interface Type: Serial (SPI)
• Supply Voltage (max): 15.75 V
• Supply Voltage (min): 10.8 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Maximum Power Dissipation: 571 mW
• Minimum Operating Temperature: - 40 C
• Supply Current: 30 uA
• Voltage Reference: External
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Figure 5. Unipolar Transfer Function
A single +12V to +15V supply is required to realize a
0 to 10V output swing. A dual ±12V to ±15V supply is
required to realize a ±10V output swing, and allows
unipolar, 0 to +10V output if UNI/BIP is forced high. A
+3V to +5V digital power supply and a +2.000V to
+5.250V external reference voltage are also required.
Always bring up the reference voltage last. The other
power supplies do not require sequencing.
4095
4094
4093
4092
2049
2048
2047
3
2
1
0
1 LSB =
Applications Information
2 x V
4096
______________________________________________________________________________________
±10V, 12-Bit, Serial, Voltage-Output DAC
REF
hex DIGITAL INPUT CODE (LSB)
Power Supplies
Figure 6. Bipolar Transfer Function
Bypass V
AGND, and bypass V
to DGND. Minimize trace lengths to reduce inductance.
Digital and AC transient signals on AGND or DGND can
create noise at the output. Connect AGND and DGND to
the highest quality ground available. Use proper ground-
ing techniques, such as a multilayer board with a low-
inductance ground plane or star connect all ground-
return paths back to AGND. Carefully lay out the traces
between channels to reduce AC crosscoupling and
crosstalk. Wire-wrapped boards, sockets, and bread-
boards are not recommended.
+2047
+2046
+2045
+2044
-2045
-2046
-2047
-2048
+1
-1
0
DD
Power-Supply Bypassing and Ground
1 LSB =
and V
4 x V
4096
SS
REF
hex DIGITAL INPUT CODE (LSB)
CC
with 0.1µF and 1.0µF capacitors to
with 0.1µF and 1.0µF capacitors
Management
17