AD9777BSVZ Analog Devices Inc, AD9777BSVZ Datasheet - Page 9

• Manufacturer Part Number: AD9777BSVZ
• Description: IC DAC 16BIT DUAL 160MSPS 80TQFP
• Manufacturer: Analog Devices Inc
• Series: TxDAC+®r

Specifications of AD9777BSVZ

• Data Interface: Parallel
• Settling Time: 11ns
• Number Of Bits: 16
• Number Of Converters: 2
• Voltage Supply Source: Analog and Digital
• Power Dissipation (max): 410mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
• Resolution (bits): 16bit
• Sampling Rate: 400MSPS
• Input Channel Type: Parallel
• Supply Voltage Range - Analog: 3.1V To 3.5V
• Supply Current: 72.5mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AD9777-EBZ - BOARD EVALUATION FOR AD9777
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter
AVDD, DVDD, CLKVDD
AVDD, DVDD, CLKVDD
AGND, DGND, CLKGND
REFIO, FSADJ1/FSADJ2
I
P1B15 to P1B0, P2B15 to P2B0, RESET
DATACLK/PLL_LOCK
CLK+, CLK−
LPF
SPI_CSB, SPI_CLK, SPI_SDIO, SPI_SDO
Junction Temperature
Storage Temperature
Lead Temperature (10 sec)
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only;
functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability.
THERMAL CHARACTERISTICS
Thermal Resistance
80-lead thin quad flat package, exposed pad [TQFP_EP]
θ
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
OUTA
JA
= 23.5°C/W (With thermal pad soldered to PCB)
, I
OUTB
With Respect To
AGND, DGND, CLKGND
AVDD, DVDD, CLKVDD
AGND, DGND, CLKGND
AGND
AGND
DGND
DGND
CLKGND
CLKGND
DGND
Rev. C | Page 9 of 60
Min
−0.3
−4.0
−0.3
−0.3
−1.0
−0.3
−0.3
−0.3
−0.3
−0.3
−65
Max
+4.0
+4.0
+0.3
AVDD + 0.3
AVDD + 0.3
DVDD + 0.3
DVDD + 0.3
CLKVDD + 0.3
CLKVDD + 0.3
DVDD + 0.3
125
+150
300
AD9777
Unit
V
V
V
V
V
V
V
V
V
V
°C
°C
°C