MCP4561-104E/MS Microchip Technology, MCP4561-104E/MS Datasheet - Page 3

• Manufacturer Part Number: MCP4561-104E/MS
• Description: IC DGTL POT 100K 256TAPS 8-MSOP
• Manufacturer: Microchip Technology

Specifications of MCP4561-104E/MS

• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Taps: 257
• Resistance (ohms): 100K
• Number Of Circuits: 1
• Temperature Coefficient: 150 ppm/°C Typical
• Memory Type: Non-Volatile
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Resistance In Ohms: 100K
• Number Of Pots: Single
• Taps Per Pot: 256
• Resistance: 100 KOhms
• Wiper Memory: Non Volatile
• Digital Interface: Serial (2-Wire, I2C)
• Operating Supply Voltage: 2.5 V, 3.3 V, 5 V
• Supply Current: 2.5 uA
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

1.0
Absolute Maximum Ratings †
Voltage on V
Voltage
respect to V
Voltage on all other pins (PxA, PxW, and PxB)
with respect to V
Input clamp current, I
(V
Output clamp current, I
(V
Maximum output current sunk by any Output pin
Maximum output current sourced by any Output pin
Maximum current out of V
Maximum current into V
Maximum current into P
Storage temperature ....................................-65°C to +150°C
Ambient temperature with power applied
Total power dissipation (Note 1) ................................400 mW
Soldering temperature of leads (10 seconds) ............. +300°C
ESD protection on all pins .................................. ≥ 4 kV (HBM),
Maximum Junction Temperature (T
© 2008 Microchip Technology Inc.
......................................................................................25 mA
......................................................................................25 mA
.......................................................................... ≥ 300V (MM)
I
O
Note 1: Power dissipation is calculated as follows:
< 0, V
< 0 or V
on HVC/A0, A1, A2, SCL, SDA, and WP
I
ELECTRICAL
CHARACTERISTICS
> V
SS .............................................................
O
DD
DD
> V
with respect to V
, V
SS .........................................
DD
I
) ..................................................±20 mA
> V
P
IK
DIS
OK
PP ON
DD
X
A, P
SS
= V
pin ....................................100 mA
pin .................................100 mA
X
DD
HV pins) ......................±20 mA
W & P
SS
x {I
J
............... -0.6V to +7.0V
) ......................... +150°C
X
DD
B pins ............±2.5 mA
- ∑ I
-0.3V to V
-40°C to +125°C
OH
-0.6V to 12.5V
} + ∑ {(V
DD
+ 0.3V
MCP454X/456X/464X/466X
with
DD
-V
OH
) x I
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
OH
} + ∑(V
OL
x I
OL
)
DS22107A-page 3