PCA9691T/1,512 NXP Semiconductors, PCA9691T/1,512 Datasheet - Page 27

• Manufacturer Part Number: PCA9691T/1,512
• Description: IC ADC/DAC 8-BIT I2C 16SOIC
• Manufacturer: NXP Semiconductors
• Type: ADC, DACr

Specifications of PCA9691T/1,512

• Resolution (bits): 8 b
• Data Interface: I²C, Serial
• Voltage Supply Source: Single Supply
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Sampling Rate (per Second): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 935283383512

NXP Semiconductors
PCA9691_2
Product data sheet
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 10.
Table 11.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 10
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
11
28.
Rev. 02 — 27 January 2010
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2 000
260
250
245
28) than a SnPb process, thus
≥ 350
220
220
8-bit A/D and D/A converter
> 2 000
260
245
245
PCA9691
© NXP B.V. 2010. All rights reserved.
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