AD7687BRMZ Analog Devices Inc, AD7687BRMZ Datasheet - Page 7

• Manufacturer Part Number: AD7687BRMZ
• Description: IC ADC 16BIT 250KSPS 10-MSOP
• Manufacturer: Analog Devices Inc
• Series: PulSAR®r

Specifications of AD7687BRMZ

• Data Interface: DSP, MICROWIRE™, QSPI™, Serial, SPI™
• Number Of Bits: 16
• Sampling Rate (per Second): 250k
• Number Of Converters: 1
• Power Dissipation (max): 12.5mW
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-TFSOP (0.118", 3.00mm Width)
• Resolution (bits): 16bit
• Sampling Rate: 250kSPS
• Input Channel Type: Differential
• Supply Voltage Range - Analog: 2.3V To 5.5V
• Supply Voltage Range - Digital: 1.8V To 5.5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: EVAL-AD7687CBZ - BOARD EVALUATION FOR AD7687
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Analog Inputs
Supply Voltages
Storage Temperature Range
Junction Temperature
Lead Temperature Range
1
See the Analog Input section.
IN+
REF
VDD, VIO to GND
VDD to VIO
Digital Inputs to GND
Digital Outputs to GND
1
, IN−
1
Rating
GND − 0.3 V to VDD + 0.3 V
or ±130 mA
GND − 0.3 V to VDD + 0.3 V
−0.3 V to +7 V
±7 V
−0.3 V to VIO + 0.3 V
−0.3 V to VIO + 0.3 V
−65°C to +150°C
150°C
JEDEC J-STD-20
30% VIO
1
2
2V IF VIO ABOVE 2.5V, VIO – 0.5V IF VIO BELOW 2.5V.
0.8V IF VIO ABOVE 2.5V, 0.5V IF VIO BELOW 2.5V.
t
DELAY
TO SDO
Figure 3. Load Circuit for Digital Interface Timing
2V OR VIO – 0.5V
0.8V OR 0.5V
Figure 4. Voltage Levels for Timing
50pF
C
L
Rev. A | Page 7 of 28
500μA
500μA
2
1
I
I
OL
OH
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 7. Thermal Resistance
Package Type
10-Lead QFN (LFCSP)
10-Lead MSOP
ESD CAUTION
70% VIO
JA
is specified for the worst-case conditions, that is, a device
t
DELAY
2V OR VIO – 0.5V
0.8V OR 0.5V
1.4V
2
1
θ
48.7
200
JA
θ
2.96
44
JC
AD7687
Unit
°C
°C