KAD5514P-25Q48 Intersil, KAD5514P-25Q48 Datasheet - Page 30

IC ADC 14BIT 250MSPS SGL 48-QFN

KAD5514P-25Q48

Manufacturer Part Number
KAD5514P-25Q48
Description
IC ADC 14BIT 250MSPS SGL 48-QFN
Manufacturer
Intersil
Series
FemtoCharge™r
Datasheet

Specifications of KAD5514P-25Q48

Number Of Bits
14
Sampling Rate (per Second)
250M
Data Interface
Serial, SPI™
Number Of Converters
1
Power Dissipation (max)
463mW
Voltage Supply Source
Single Supply
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
48-VQFN
For Use With
KDC5514-Q48EVAL - DAUGHTER CARD FOR KAD5514KDC5514EVALZ - DAUGHTER CARD FOR KAD5514
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
KAD5514P-25Q48
Manufacturer:
Intersil
Quantity:
1 400
Equivalent Circuits
72 Pin/48 Pin Package Options
The KAD5514 is available in both 72 pin and 48 pin
packages. The 48 pin package option supports LVDS DDR
only. A reduced set of pin selectable functions are available
in the 48 pin package due to the reduced pinout;
(OUTMODE, OUTFMT, and CLKDIV pins are not available).
Table 17 shows the default state for these functions for the
48 pin package. Note that these functions are available
through the SPI, allowing a user to set these modes as they
desire, offering the same flexibility as the 72 pin package
option. DC and AC performance of the ADC is equivalent for
both package options.
.
ADC Evaluation Platform
Intersil offers an ADC Evaluation platform which can be used
to evaluate any of the KADxxxxx ADC family. The platform
consists of a FPGA based data capture motherboard and a
family of ADC daughtercards. This USB based platform
allows a user to quickly evaluate the ADC’s performance at a
user’s specific application frequency requirements. More
information is available at
http://www.intersil.com/converters/adc_eval_platform/
Layout Considerations
Split Ground and Power Planes
Data converters operating at high sampling frequencies
require extra care in PC board layout. Many complex board
designs benefit from isolating the analog and digital
sections. Analog supply and ground planes should be laid
out under signal and clock inputs. Locate the digital planes
FUNCTION
OUTMODE
OUTFMT
CLKDIV
TABLE 17. 48 PIN SPI - ADDRESSABLE FUNCTIONS
DESCRIPTION
Clock Divider
Output Driver
Data Coding
Mode
(Continued)
30
0.535V
Two’s Complement
LVDS, 3mA (DDR)
DEFAULT STATE
Divide by 1
+
FIGURE 49. VCM_OUT OUTPUT
KAD5514P
under outputs and logic pins. Grounds should be joined
under the chip.
Clock Input Considerations
Use matched transmission lines to the transformer inputs for
the analog input and clock signals. Locate transformers and
terminations as close to the chip as possible.
Exposed Paddle
The exposed paddle must be electrically connected to
analog ground (AVSS) and should be connected to a large
copper plane using numerous vias for optimal thermal
performance.
Bypass and Filtering
Bulk capacitors should have low equivalent series
resistance. Tantalum is a good choice. For best
performance, keep ceramic bypass capacitors very close to
device pins. Longer traces will increase inductance, resulting
in diminished dynamic performance and accuracy. Make
sure that connections to ground are direct and low
impedance. Avoid forming ground loops.
LVDS Outputs
Output traces and connections must be designed for 50Ω
(100Ω differential) characteristic impedance. Keep traces
direct and minimize bends where possible. Avoid crossing
ground and power-plane breaks with signal traces.
LVCMOS Outputs
Output traces and connections must be designed for 50Ω
characteristic impedance.
Unused Inputs
Standard logic inputs (RESETN, CSB, SCLK, SDIO, SDO)
which will not be operated do not require connection to
ensure optimal ADC performance. These inputs can be left
floating if they are not used. Tri-level inputs (NAPSLP,
OUTMODE, OUTFMT, CLKDIV) accept a floating input as a
valid state, and therefore should be biased according to the
desired functionality.
AVDD
VCM
September 10, 2009
FN6804.2

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